Nickel structures and methods for manufacturing the same by removal of an underlying material
First Claim
1. A structure comprising:
- a multiple-layer electrical circuit board having an arm, wherein the arm has a connected end connected to the multiple-layer electrical circuit board and an unconnected end located opposite to the connected end of the arm, wherein the arm has a front side and a backside located opposite to the front side of the arm, wherein the backside of the arm is located adjacent to the multiple layer electrical circuit board,a dimple formed on the unconnected end on a front side of the arm,an air gap formed between the backside of the arm and the multiple-layer electrical circuit board, permitting the arm to flex into a space of the air gap, wherein the air gap is a completely empty space extending from the backside of the unconnected end of the arm to the multiple-layer electrical circuit board, and the air gap measured from the backside of the arm to the multiple-layer electrical circuit board is about 15 microns to about 45 microns, andan adhesive film laminated to the printed circuit board, wherein the adhesive film is translucent and includes openings to permit the arm to pass therethrough.
1 Assignment
0 Petitions
Accused Products
Abstract
A printed circuit board includes a multiple-layer electrical circuit board and a nickel arm, wherein the nickel arm has an unconnected end located opposite to the connected end of the nickel arm, wherein the nickel arm has a front side and a backside located opposite to the front side of the nickel arm, wherein the backside of the nickel arm is located adjacent to the multiple layer electrical circuit board. A dimple is formed at the unconnected end of the nickel arm and on the front side of the nickel arm. An air gap is formed between the backside of the arm and the multiple layer electrical circuit board, wherein the air gap permits the arm to flex within the air gap. A lead zirconium titanate element is laminated to the printed circuit board, wherein the dimple on the front side of the arm contacts a surface of the lead zirconium titanate element, wherein a restoring spring force of the nickel arm maintains electrical contactivity between the dimple and the lead zirconium titanate element.
4 Citations
13 Claims
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1. A structure comprising:
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a multiple-layer electrical circuit board having an arm, wherein the arm has a connected end connected to the multiple-layer electrical circuit board and an unconnected end located opposite to the connected end of the arm, wherein the arm has a front side and a backside located opposite to the front side of the arm, wherein the backside of the arm is located adjacent to the multiple layer electrical circuit board, a dimple formed on the unconnected end on a front side of the arm, an air gap formed between the backside of the arm and the multiple-layer electrical circuit board, permitting the arm to flex into a space of the air gap, wherein the air gap is a completely empty space extending from the backside of the unconnected end of the arm to the multiple-layer electrical circuit board, and the air gap measured from the backside of the arm to the multiple-layer electrical circuit board is about 15 microns to about 45 microns, and an adhesive film laminated to the printed circuit board, wherein the adhesive film is translucent and includes openings to permit the arm to pass therethrough. - View Dependent Claims (2, 3, 4, 13)
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5. A structure comprising:
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a printed circuit board including a multiple-layer electrical circuit board having an arm, wherein the arm has a connected end connected to the multiple-layer electrical circuit board and an unconnected end located opposite to the connected end of the arm, wherein the arm has a front side and a backside located opposite to the front side of the arm, wherein the backside of the arm is located adjacent to the multiple layer electrical circuit board, a dimple formed on the unconnected end on a front side of the arm, an air gap formed between the backside of the arm and the multiple-layer electrical circuit board, permitting the arm to flex into a space of the air gap, wherein the air gap is a completely empty space extending from the backside of the unconnected end of the arm to the multiple-layer electrical circuit board; and a lead zirconium titanate element laminated to the printed circuit board, wherein the dimple contacts the lead zirconium titanate element and wherein the arm is flexed into the air gap toward the multiple-layer electrical circuit board, wherein a restoring spring force of about 1 gram force to about 2 gram force is exerted by the flexed arm to maintain electrical contactivity between the dimple and the lead zirconium titanate element. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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Specification