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Method and apparatus for cooling electronic components

  • US 7,757,497 B1
  • Filed: 01/19/2009
  • Issued: 07/20/2010
  • Est. Priority Date: 03/09/2005
  • Status: Expired due to Fees
First Claim
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1. A method comprising cooling a heat generating component by delivering two or more overlapping full-cone sprays at a surface of the heat generating component, wherein each of the overlapping full-cone sprays includes a non-uniform density such that the overlapping portion of each of the spray cones has a lower spray density than the non-overlapping portions of each of the spray cones.

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