High volume pagewidth printing
First Claim
1. A print assembly for pagewidth inkjet printing, the print assembly comprisingan elongate carrier that is mountable on a support structure of a printer in an operative position with respect to a platen of the printer;
- a number of printhead chips positioned on the carrier, the printhead chips each having a plurality of ink ejection nozzle arrangements on a wafer substrate, each nozzle arrangement having an actuator for ejecting ink from an associated nozzle when a resistive element of said actuator is heated by an electrical current supplied by drive circuitry on the wafer substrate; and
a plurality of controllers, each controller mounted on a respective printed circuit board that is positioned on the carrier, each controller being connected to a plurality of the printhead chips via individual flexible printed circuit boards of each printhead chip and to the other controllers, and each controller being configured to control operation of at least 10,000 nozzle arrangements of the connected printhead chips.
3 Assignments
0 Petitions
Accused Products
Abstract
A print assembly (14) for pagewidth inkjet printing that includes an elongate carrier that is mountable on a support structure (12) of a printer (10) in an operative position with respect to a platen (106, 108) of the printer. A number of printhead chips (186) are positioned on the carrier. The print head chips together define a print head that is configured to eject at least one billion drops per second into a printing zone defined between the print head and the platen of the printer. Control circuitry is also positioned on the carrier and is configured to control operation of the print head chips.
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Citations
8 Claims
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1. A print assembly for pagewidth inkjet printing, the print assembly comprising
an elongate carrier that is mountable on a support structure of a printer in an operative position with respect to a platen of the printer; -
a number of printhead chips positioned on the carrier, the printhead chips each having a plurality of ink ejection nozzle arrangements on a wafer substrate, each nozzle arrangement having an actuator for ejecting ink from an associated nozzle when a resistive element of said actuator is heated by an electrical current supplied by drive circuitry on the wafer substrate; and a plurality of controllers, each controller mounted on a respective printed circuit board that is positioned on the carrier, each controller being connected to a plurality of the printhead chips via individual flexible printed circuit boards of each printhead chip and to the other controllers, and each controller being configured to control operation of at least 10,000 nozzle arrangements of the connected printhead chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification