Anti-stiction coating
First Claim
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1. A process of manufacturing microelectronic devices, comprising:
- placing a wafer in a deposition chamber, said wafer comprising a number of microelectronic devices, said microelectronic devices comprising a number of bump regions, said bump regions comprising a dielectric material; and
depositing an anti-stiction coating only on said bump regions,in which said anti-stiction coating is configured to react with said dielectric material of said bump regions.
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Abstract
One embodiment of a microelectronic device includes a movable plate including a lower surface, a bump positioned on the lower surface, and an anti-stiction coating positioned only on the bump.
28 Citations
32 Claims
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1. A process of manufacturing microelectronic devices, comprising:
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placing a wafer in a deposition chamber, said wafer comprising a number of microelectronic devices, said microelectronic devices comprising a number of bump regions, said bump regions comprising a dielectric material; and depositing an anti-stiction coating only on said bump regions, in which said anti-stiction coating is configured to react with said dielectric material of said bump regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A process of depositing an anti-stiction coating, comprising:
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enclosing a microelectromechanical device (MEMS device) in a deposition chamber, said MEMS device including a bump area, said bump area comprising a dielectric material; and depositing an anti-stiction coating only on said bump area, in which said anti-stiction coating is configured to react with said dielectric material of said bump area. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A process of depositing an anti-stiction coating, comprising:
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positioning a microelectronic device for deposition, said microelectronic device including at least one bump region, said bump region comprising a dielectric material; and reacting fluorodecyltrichlorosilane only on said bump region of said microelectronic device. - View Dependent Claims (28, 29, 30, 31, 32)
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Specification