White light emitting diode

• US 7,759,683 B2
• Filed: 05/15/2006
• Issued: 07/20/2010
• Est. Priority Date: 12/01/2005
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Ik Soo
• Primary Examiner(s): Loke; Steven
• Assistant Examiner(s): CHI, SUBERR L
• Application Number:
  US11/435,400
• Publication Number:
  US 20070126011A1
• Time in Patent Office: 1,527 Days
• Field of Search: 257/79, 257/80, 257 81- 86, 257/88, 257/90, 257 91- 93, 257/95, 257 98-100, 257/E33.001, 362/231, 362/800, 362/236, 362/240, 313/1, 313/498, 438/28, 438/29, 438/35, 438/22, 438/23
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/50 Wavelength conversion elements

Abstract

The present invention relates to a white light emitting diode comprising a blue light emitting diode chip; a green light emitting diode chip; and a molding member that encapsulates the blue light emitting diode chip and the green light emitting diode chip, the molding member containing a red fluorescent substance.

Claims

1. A white light emitting diode, comprising:

a substrate;

first, second, third, and fourth terminals on the substrate;

a blue light emitting diode chip on the first terminal and in electrical communication with the first and second terminals;

a green light emitting diode chip on the third terminal and in electrical communication with the third and fourth terminals; and

a molding member for encapsulating the blue light emitting diode chip and the green light emitting diode chip, wherein the molding member comprises a red fluorescent substance, and further wherein the blue light emitting diode chip and the green light emitting diode chip are electrically isolated from each other, and further wherein the blue light emitting diode chip and the green light emitting diode chip are disposed diagonally across from each other and, within the molding member, the second terminal and fourth terminal are disposed diagonally across from each other.

2. The white light emitting diode as claimed in claim 1, wherein the red fluorescent substance comprises (Sr_1-xEu_x)S or (Ca_1-xEu_x)S where x is 0.001 to 0.02.

3. The white light emitting diode as claimed in claim 2, wherein the molding member comprises a resin.

4. The white light emitting diode as claimed in claim 2,

wherein a reflective portion is arranged on the substrate to reflect light emitted from the light emitting diode chips in a predetermined direction.