Anti-reflection structures for CMOS image sensors
First Claim
Patent Images
1. A semiconductor structure comprising:
- a photodiode located on a first surface of a semiconductor layer;
a metal interconnect layer located on said first surface of said semiconductor layer; and
an insulator layer located on a second surface of said semiconductor layer, wherein said second surface is located on an opposite side of said first surface, and wherein said insulator layer includes an array of protuberances at an interface with an ambient gas or vacuum, wherein a pitch of said protuberances is less than 270 nm.
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Abstract
Optical structures having an array of protuberances between two layers having different refractive indices are provided. The array of protuberances has vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode of a CMOS image sensor. The array of protuberances provides high transmission of light with little reflection. The array of protuberances may be provided over a photodiode, in a back-end-of-line interconnect structure, over a lens for a photodiode, on a backside of a photodiode, or on a window of a chip package.
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Citations
16 Claims
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1. A semiconductor structure comprising:
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a photodiode located on a first surface of a semiconductor layer; a metal interconnect layer located on said first surface of said semiconductor layer; and an insulator layer located on a second surface of said semiconductor layer, wherein said second surface is located on an opposite side of said first surface, and wherein said insulator layer includes an array of protuberances at an interface with an ambient gas or vacuum, wherein a pitch of said protuberances is less than 270 nm. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor structure comprising:
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a photodiode located on a first surface of a semiconductor layer; a metal interconnect layer located on said first surface of said semiconductor layer; and an insulator layer located on a second surface of said semiconductor layer, wherein said second surface is located on an opposite side of said first surface, said insulator layer includes an array of protuberances at an interface with an ambient gas or vacuum, and said array is a regular hexagonal array. - View Dependent Claims (8, 9, 10, 11)
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12. A semiconductor structure comprising:
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a photodiode located on a first surface of a semiconductor layer; a metal interconnect layer located on said first surface of said semiconductor layer; and an insulator layer located on a second surface of said semiconductor layer, wherein said second surface is located on an opposite side of said first surface, said insulator layer includes an array of protuberances at an interface with an ambient gas or vacuum, and wherein each of said array of protuberances has a shape of a cone having a monotonically decreasing cross-sectional area as a function of a vertical distance from a base of said cone, and said cone has a height from about 40 nm to about 480 nm. - View Dependent Claims (13, 14, 15, 16)
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Specification