Acoustic decoupling in cMUTs

• US 7,759,839 B2
• Filed: 04/04/2007
• Issued: 07/20/2010
• Est. Priority Date: 04/04/2006
• Status: Active Grant

• Current Assignee: Kolo Medical, Ltd.
• Original Assignee: Kolo Technologies, Inc.
• Inventors: Huang, Yongli
• Primary Examiner(s): Dougherty; Thomas M
• Application Number:
  US11/696,652
• Publication Number:
  US 20070228878A1
• Time in Patent Office: 1,203 Days
• Field of Search: 310/307, 310/334, 310/309, 295/94, 736/49
• US Class Current: 310/309
• CPC Class Codes: B06B 1/0238 of a single frequency, e.g. a sine-wave
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: G01N 29/2406 Electrostatic or capacitive probes, e.g. electret or cMUT-probes
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

A capacitive micromachined ultrasonic transducer (cMUT) has an acoustic decoupling feature. A cavity is introduced underneath the regular cMUT element, preferably in the substrate, to provide acoustic decoupling. Trenches are also introduced to separate the cMUT elements and to provide further acoustic decoupling. The acoustic decoupling feature may be used in both conventional membrane-based cMUT and the newer embedded-spring cMUT (ESCMUT). Exemplary fabrication methods are also described.

Claims

1. A capacitive micromachined ultrasonic transducer (cMUT), comprising:

a base having a lower base portion and an upper base portion, the lower base portion and the upper base portion defining a cavity therebetween, the upper base portion having a first electrode; and

a movable layer disposed above the upper base portion and supported by a support connected to the upper base portion, the support spacing the movable layer from the upper base portion to define a transducing space, the movable layer having a second electrode opposing the first electrode to evacuate a variable capacitor between the base and the movable layer.

2. The cMUT as recited in claim 1, wherein the lower base portion comprises a substrate.

3. The cMUT as recited in claim 1, wherein the cavity is formed on the lower base portion by removing a part of the lower base portion.

4. The cMUT as recited in claim 1, wherein the upper base portion comprises a separate layer placed over the cavity.

5. The cMUT as recited in claim 1, wherein the bottom electrode comprises a separate layer placed over the cavity, the separate layer being electrically conductive.

6. The cMUT as recited in claim 1, wherein the upper base portion comprises a support layer placed over the cavity, the support layer being electrically non-conductive, and wherein the first electrode comprises a conductive layer placed on the support layer.

7. The cMUT as recited in claim 1, wherein the movable layer comprises a membrane, and wherein the second electrode is placed on the membrane.

8. The cMUT as recited in claim 1, wherein the upper base portion has a thickness that is small enough to result in an acoustic ring frequency that is substantially separated from an operating frequency of the cMUT.

9. The cMUT as recited in claim 1, wherein the cMUT is divided by trenches into a plurality of cMUT elements each having a variable capacitor element and a cavity element below the variable capacitor element.

10. The cMUT as recited in claim 9, wherein the cMUT includes a surface plate and a spring layer, and the trenches are formed through the surface plate, the spring layer and the upper base portion.

11. A capacitive micromachined ultrasonic transducer (cMUT), comprising:

a base having a lower base portion and an upper base portion, the lower base portion and the upper base portion defining a cavity therebetween;

a spring layer disposed above the upper base portion and anchored by a spring anchor connected to the upper base portion, the spring anchor spacing the spring layer from the upper base portion to form a cantilever-like structure having an anchored portion and a movable portion; and

a surface plate disposed above the spring layer and supported by a spring-plate connector connected to the movable portion of the spring layer, the spring-plate connector spacing the surface plate from the spring layer to define a transducing space, wherein the surface plate includes a top electrode, and wherein at least one of the spring layer, the spring anchor and the upper base portion includes a bottom electrode opposing the top electrode to evacuate a variable capacitor therebetween.

12. The cMUT as recited in claim 11, wherein the lower base portion comprises a substrate.

13. The cMUT as recited in claim 11, wherein the cavity is formed on the lower base portion by removing a part of the lower base portion.

14. The cMUT as recited in claim 11, wherein the upper base portion comprises a separate layer placed over the cavity.

15. The cMUT as recited in claim 11, wherein the bottom electrode comprises a separate conductive layer which is a part of the spring layer.

16. The cMUT as recited in claim 11, wherein the bottom electrode is an integral part of the spring layer.

17. The cMUT as recited in claim 11, wherein the cMUT is divided by trenches into a plurality of cMUT elements each having a variable capacitor element and a cavity element below the variable capacitor element.

18. The cMUT as recited in claim 17, wherein the trenches are formed through both the surface plate and the spring layer.

19. The cMUT as recited in claim 17, wherein the trenches are formed through the surface plate, the spring layer and the upper base portion.

20. A method for fabricating a capacitive micromachined ultrasonic transducer, the method comprising:

providing a substrate;

forming a cavity on a surface of the substrate;

placing a cover layer over the cavity; and

completing a cMUT structure on top of the cover layer, wherein the cMUT structure includes a spring layer disposed above the cover layer and a first electrode and a second electrode defining a variable capacitor, at least one of the first electrode and the second electrode being movable to vary the variable capacitor.

21. The method as recited in claim 20, wherein the first electrode resides in or on the cover layer.

22. A method for fabricating a capacitive micromachined ultrasonic transducer, the method comprising:

providing a substrate;

forming a cavity on a surface of the substrate;

placing a cover layer over the cavity;

forming a spring anchor on the cover layer;

placing a spring layer over the spring anchor, when placed the spring layer having an anchored portion and a movable portion, the anchored portion being anchored and the spring anchor;

forming a spring-plate connector on the movable portion of the spring layer; and

placing a surface plate over the spin-plate connector,

wherein the cMUT structure includes a first electrode and a second electrode defining a variable capacitor, at least one of the first electrode and the second electrode being movable to vary the variable capacitor.