Multiband antenna array using electromagnetic bandgap structures

• US 7,760,140 B2
• Filed: 06/09/2006
• Issued: 07/20/2010
• Est. Priority Date: 06/09/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kamgaing, Telesphor
• Primary Examiner(s): DINH, TRINH VO
• Application Number:
  US11/449,915
• Publication Number:
  US 20070285336A1
• Time in Patent Office: 1,502 Days
• Field of Search: None
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/2258 used with computer equipment
• CPC Class Codes: H01Q 1/241 used in mobile communications, e.g. GSM H01Q1/247, H01Q1/248 take precedence
• CPC Class Codes: H01Q 1/523 between antennas of an array
• CPC Class Codes: H01Q 15/008 said selective devices having Sievenpipers' mushroom elements

Abstract

In some embodiments, a multiband antenna array using electromagnetic bandgap structures is presented. In this regard, an antenna array is introduced having two or more planar antennas situated substantially on a surface of a substrate, a first set of electromagnetic bandgap (EBG) cells situated substantially between and on plane with the antennas, and a second set of EBG cells situated within the substrate below the antennas. Other embodiments are also disclosed and claimed.

Claims

1. An antenna array comprising:

two or more planar antennas situated substantially on a surface of a substrate;

a first set of electromagnetic bandgap (EBG) patches situated substantially between and on plane with the antennas; and

a second set of EBG patches to limit the propagation of a radiating wave situated within a dielectric material within the substrate below the antennas, wherein the EBG patches are coupled with a grounded metal layer within the dielectric material.

2. The antenna array of claim 1, further comprising four antennas arranged in a substantially square pattern.

3. The antenna array of claim 2, further comprising antennas situated within the substrate.

4. The antenna array of claim 1, wherein the first set of EBG patches comprises spiral-based EBG patches.

5. The antenna array of claim 1, wherein the first set of EBG patches comprises four rows of EBG patches.

6. The antenna array of claim 1, wherein the second set of EBG patches comprises patches having a width of about 750 μ

m.

7. An apparatus comprising:

a printed circuit board;

a wireless network controller soldered to the printed circuit board; and

an antenna array soldered to the printed circuit board, the antenna array comprising;

two or more planar antennas situated substantially on a surface of a substrate;

a first set of electromagnetic bandgap (EBG) patches to limit the propagation of a radiating wave situated substantially between and on plane with the antennas, wherein the first set of EBG patches are coupled with a grounded metal layer within a dielectric material within the substrate; and

a second set of EBG patches situated within the dielectric material below the antennas.

8. The apparatus of claim 7, further comprising four antennas arranged in a substantially square pattern.

9. The apparatus of claim 8, further comprising antennas situated within the substrate.

10. The apparatus of claim 7, wherein the first set of EBG patches comprises spiral-based EBG patches.

11. The apparatus of claim 7, wherein the second set of EBG patches comprises patches having a width of about 750 μ

m.

12. An electronic appliance comprising:

a wireless network controller;

a system memory;

a processor; and

an antenna array, wherein the antenna array includes two or more planar antennas situated substantially on a surface of a substrate, a first set of electromagnetic bandgap (EBG) patches to limit the propagation of a radiating wave situated substantially between the antennas; and

a second set of EBG patches situated within a dielectric material within the substrate below the antennas, wherein the EBG patches are coupled with a grounded metal layer within the dielectric material.

13. The electronic appliance of claim 12, further comprising four antennas arranged in a substantially square pattern.

14. The electronic appliance of claim 13, further comprising antennas situated within the substrate.

15. The electronic appliance of claim 12, wherein the first set of EBG patches comprises spiral-based EBG patches.

16. The electronic appliance of claim 12, wherein the first set of EBG patches comprises four rows of EBG patches.

17. A method comprising:

forming two or more planar antennas substantially on a surface of a package substrate;

forming a first set of electromagnetic bandgap (EBG) patches to limit the propagation of a radiating wave substantially between the antennas;

forming a second set of EBG patches within a dielectric material within the substrate below the antennas; and

forming metal layers within the dielectric material which serve as ground planes coupled with the EBG patches.

18. The method of claim 17, further comprising forming four antennas arranged in a substantially square pattern.

19. The method of claim 17, further comprising forming a multi-layer organic substrate.