Component placement device

• US 7,761,977 B2
• Filed: 07/01/2004
• Issued: 07/27/2010
• Est. Priority Date: 07/03/2003
• Status: Expired due to Fees

• Current Assignee: Assembleon B.V.
• Original Assignee: Assembleon B.V.
• Inventors: Thomassen, Jacobus A. M.
• Primary Examiner(s): Banks; Derris H
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US10/563,091
• Publication Number:
  US 20060156539A1
• Time in Patent Office: 2,217 Days
• Field of Search: 297/40, 297/39, 297/41, 297/42, 297/86, 297/43, 297/66, 198/369.1, 198/419.2, 198/407, 414/737, 414/752, 901/7, 901/39, 269/295, 269/304
• US Class Current: 29/739
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53183 Multilead component
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part
• CPC Class Codes: Y10T 29/53291 Slide fastener

Abstract

A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Claims

1. A component placement device comprising:

an elongated transport device that is configured to transport a first substrate in a transport direction parallel to the transport device;

at least one component feeder that is located along a longitudinal side of the transport device;

at least one component pick-and-place unit that is configured to;

(a) pick-up a component from the at least one component feeder; and

(b) place the component on the first substrate supported by the elongated transport device; and

at least one substrate support that is configured to support a second substrate, wherein the at least one substrate support is positioned on only one longitudinal side of the transport device that is opposite from the longitudinal side at which the component feeder is located, and the at least one substrate support has a longitudinal direction that extends perpendicular to the transport direction,

wherein the at least one component pick-and-place unit is further configured to;

(c) pick-up a component from the at least one component feeder; and

(d) move the component over the elongated transport device to place the component on the second substrate supported by the substrate support.

2. The component placement device as claimed in claim 1, wherein the substrate support is detachably connected to the component placement device.

3. The component placement device as claimed in claim 1, wherein the substrate support comprises drive means configured to transport the second substrate in a feeding direction that extends transverse to the transport direction.

4. The component placement device as claimed in claim 3, wherein the substrate support comprises two guides that extend parallel to each other and transverse to the transport direction.

5. The component placement device as claimed in claim 4, wherein a distance between the guides is adjustable.

6. The component placement device as claimed in claim 3, wherein the substrate support is configured to be moved vertically from a position parallel to the transport device to a position underneath the transport device.

7. The component placement device as claimed in claim 1, wherein the transport device comprises at least one guide profile that extends parallel to the transport direction,

wherein the at least one guide profile is connected to the substrate support, and

wherein the at least one guide profile is configured to be moved together with the substrate support in a direction that extends transverse to the transport direction.

8. The component placement device as claimed in claim 7, wherein the substrate support comprises two guides that extend parallel to each other and transverse to the transport direction.

9. The component placement device as claimed in claim 8, wherein a distance between the guides is adjustable.

10. The component placement device as claimed in claim 7, wherein the substrate support is configured to be moved vertically from a position parallel to the transport device to a position underneath the transport device.

11. The component placement device as claimed in claim 1, wherein the substrate support is configured to be moved vertically from a position parallel to the transport device to a position underneath the transport device.

12. The component placement device as claimed in claim 1, wherein the at least one substrate support is configured to move the second substrate in a direction perpendicular to the transport direction.

13. A component placement device comprising:

an elongated transport device that is configured to transport a first substrate in a transport direction parallel to the transport device;

a component feeder that is located only on one longitudinal side of the transport device;

at least one component pick-and-place unit that is configured to;

(a) pick-up a component from the at least one component feeder; and

(b) place the component on the first substrate supported by the elongated transport device; and

at least one substrate support that is configured to support a second substrate, wherein the at least one substrate support is positioned on only one longitudinal side of the transport device that is opposite from the longitudinal side at which the component feeder is located, and the at least one substrate support has a longitudinal direction that extends perpendicular to the transport device,

wherein the at least one component pick-and-place unit is configured to;

(c) pick-up a component from the at least one component feeder; and

(d) move the component over the elongated transport device to place the component on the second substrate supported by the substrate support.