Wireless IC device

• US 7,762,472 B2
• Filed: 12/26/2007
• Issued: 07/27/2010
• Est. Priority Date: 07/04/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru
• Primary Examiner(s): Lee; Seung H
• Application Number:
  US11/964,185
• Publication Number:
  US 20090008460A1
• Time in Patent Office: 944 Days
• Field of Search: 235/375, 235/385, 235/435, 235/439, 235/474, 235/492, 235/493, 343/700.MS
• US Class Current: 235/492
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H04B 5/22 Capacitive coupling

Abstract

An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.

Claims

1. A wireless integrated circuit device comprising:

a high-frequency device including a wireless integrated circuit chip and a feeder circuit board in electrical communication with the wireless integrated circuit chip, the feeder circuit board being coupled to an external circuit; and

a radiation electrode coupled to the high-frequency device mounted thereon, the radiation electrode being part of an article and acting as a radiator.

2. The wireless integrated circuit device according to claim 1, wherein the high-frequency device is an electromagnetic-coupling module or a wireless integrated circuit chip.

3. The wireless integrated circuit device according to claim 1, wherein the radiation electrode includes a conductive portion having a predetermined area, the conductive portion includes a cut-out section at an edge, the high-frequency device is disposed in the cut-out section, and the high-frequency device is coupled to the conductive portion within the cut-out section.

4. The wireless integrated circuit device according to claim 1, wherein the radiation electrode includes a conductive portion having a predetermined area and having a non-conductive section, the high-frequency device is disposed at an edge in the non-conductive section, and the high-frequency device is coupled to the conductive portion being in the vicinity of the non-conductive section.

5. The wireless integrated circuit device according to claim 1, further comprising a loop electrode disposed in an implementation region for the high-frequency device such that a loop surface of the loop electrode is oriented in an in-plane direction of the radiation electrode, the loop electrode being coupled to the high-frequency device and being in direct electrical communication with the radiation electrode.

6. The wireless integrated circuit device according to claim 1, further comprising a loop electrode disposed in an implementation region for the high-frequency device, the loop electrode being coupled to the high-frequency device, the loop electrode being electromagnetically coupled to the radiation electrode with an insulating layer disposed therebetween.

7. The wireless integrated circuit device according to claim 5, further comprising a matching electrode disposed between the implementation region for the high-frequency device and the loop electrode, the matching electrode being configured to enable direct communication between the high-frequency device and the loop electrode.

8. The wireless integrated circuit device according to claim 6, further comprising a matching electrode disposed between the implementation region for the high-frequency device and the loop electrode, the matching electrode being configured to enable direct communication between the high-frequency device and the loop electrode.

9. The wireless integrated circuit device according to claim 1, further comprising at least one of a resonant circuit and a matching circuit disposed in the feeder circuit board.

10. The wireless integrated circuit device according to claim 1, wherein the radiation electrode comprises a metallic layer of an article package in which a sheet containing a conductive layer is formed into a bag or a pack.

11. The wireless integrated circuit device according to claim 1, wherein the radiation electrode comprises an electrode pattern disposed on a circuit board in an electronic apparatus.

12. The wireless integrated circuit device according to claim 1, wherein the radiation electrode comprises a metallic plate disposed on a back surface of a component in an electronic apparatus.