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Method for forming isolation structure of different widths in semiconductor device

  • US 7,763,524 B2
  • Filed: 06/28/2007
  • Issued: 07/27/2010
  • Est. Priority Date: 10/31/2006
  • Status: Expired due to Fees
First Claim
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1. A method for forming an isolation structure in a semiconductor device, wherein the semiconductor device includes a substrate comprising a first region and a second region, the second region having an isolation structure formed to a larger width than a plurality of isolation structures formed in the first region, the method comprising:

  • etching portions of the first and second regions of the substrate to form first and second trenches, respectively, wherein a width of the second trench is larger than that of the first trench;

    forming a first insulation layer to fill a portion of the first and second trenches;

    directly after forming the first insulation layer, forming a barrier layer over the first insulation layer;

    etching portions of the first insulation layer and the barrier layer;

    removing the barrier layer; and

    forming a second insulation layer over the first insulation layer to fill the first and second trenches,wherein the barrier layer is foamed to have a smaller thickness in the second region than in the first region,wherein etching portions of the first insulation layer and the barrier layer in the first region comprises;

    forming a photoresist pattern over the barrier layer of the second trench; and

    performing a first etch process to etch the portions of the first insulation layer and the barrier layer in the first region using the photoresist pattern.

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