Post last wiring level inductor using patterned plate process
First Claim
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1. A semiconductor structure, comprising:
- a substrate having a metal wiring level within the substrate;
a capping layer on and above a top surface of the substrate;
an insulative layer on and above a top surface of the capping layer;
an inductor comprising a first portion in and above the insulative layer and a second portion in and above the insulative layer; and
a wire bond pad within the insulative layer, wherein the first portion of the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer,wherein a top surface of the first part of the first portion of the inductor and a top surface of the first part of the second portion of the inductor are coplanar.
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Abstract
A semiconductor structure. The semiconductor structure includes: a substrate having at least one metal wiring level within the substrate; an insulative layer on a surface of the substrate; an inductor within the insulative layer; and a wire bond pad within the insulative layer. The inductor and the wire bond pad are substantially co-planar. The inductor has a height greater than a height of the wire bond pad.
37 Citations
10 Claims
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1. A semiconductor structure, comprising:
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a substrate having a metal wiring level within the substrate; a capping layer on and above a top surface of the substrate; an insulative layer on and above a top surface of the capping layer; an inductor comprising a first portion in and above the insulative layer and a second portion in and above the insulative layer; and a wire bond pad within the insulative layer, wherein the first portion of the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer, wherein a top surface of the first part of the first portion of the inductor and a top surface of the first part of the second portion of the inductor are coplanar. - View Dependent Claims (2, 3, 4)
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5. A semiconductor structure, comprising:
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a substrate having a metal wiring level within the substrate; a capping layer on and above a top surface of the substrate; an insulative layer on and above a top surface of the capping layer; an inductor comprising a first portion in and above the insulative layer and a second portion in and above the insulative layer; and a wire bond pad within the insulative layer, wherein the first portion of the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer, wherein a bottom surface of the insulative layer is in direct mechanical contact with the top surface of the capping layer, and wherein a bottom surface of the capping layer is in direct mechanical contact with at the top surface of the substrate, wherein the first portion of the inductor comprises a first part disposed only above the insulative layer, a second part contiguous with the first part of the first portion of the inductor and disposed only above and within the insulative layer, and a third part contiguous with the second part of the first portion of the inductor and disposed within the insulative layer and the capping layer, wherein the second portion of the inductor comprises a first part disposed only above the insulative layer and a second part contiguous with the first part of the second portion of the inductor and disposed only above and within the insulative layer, wherein a width of the first part of the first portion of the inductor in a second direction exceeds a width of the second part of the first portion of the inductor in the second direction, wherein a width of the second part of the first portion of the inductor in the second direction exceeds a width of the third part of the first portion of the inductor in the second direction, wherein a width of the first part of the second portion of the inductor in the second direction exceeds a width of the second part of the second portion of the inductor in the second direction, and wherein the second direction is orthogonal to the first direction. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification