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Integrated circuit module with integrated passive device

  • US 7,763,976 B2
  • Filed: 09/30/2008
  • Issued: 07/27/2010
  • Est. Priority Date: 09/30/2008
  • Status: Expired due to Fees
First Claim
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1. An IC module, comprising:

  • an IC panel, comprising;

    an electrically conductive embedded ground plane (EGP) defining an integrated circuit (IC) cavity and an integrated passive device (IPD) cavity;

    an IC die positioned wherein a perimeter of the IC cavity surrounds the IC die; and

    an encapsulating material encapsulating substantially all but an active surface of the IC die and the EGP and filling the IPD cavity; and

    an IPD structure overlying an upper surface of the IC panel, wherein the IPD structure defines an IPD having a first terminal in electrical contact with the IC die and wherein at least a portion of the IPD overlies the encapsulating material filling the IPD cavity.

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