Integrated circuit module with integrated passive device
First Claim
1. An IC module, comprising:
- an IC panel, comprising;
an electrically conductive embedded ground plane (EGP) defining an integrated circuit (IC) cavity and an integrated passive device (IPD) cavity;
an IC die positioned wherein a perimeter of the IC cavity surrounds the IC die; and
an encapsulating material encapsulating substantially all but an active surface of the IC die and the EGP and filling the IPD cavity; and
an IPD structure overlying an upper surface of the IC panel, wherein the IPD structure defines an IPD having a first terminal in electrical contact with the IC die and wherein at least a portion of the IPD overlies the encapsulating material filling the IPD cavity.
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Accused Products
Abstract
A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.
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Citations
19 Claims
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1. An IC module, comprising:
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an IC panel, comprising; an electrically conductive embedded ground plane (EGP) defining an integrated circuit (IC) cavity and an integrated passive device (IPD) cavity; an IC die positioned wherein a perimeter of the IC cavity surrounds the IC die; and an encapsulating material encapsulating substantially all but an active surface of the IC die and the EGP and filling the IPD cavity; and an IPD structure overlying an upper surface of the IC panel, wherein the IPD structure defines an IPD having a first terminal in electrical contact with the IC die and wherein at least a portion of the IPD overlies the encapsulating material filling the IPD cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 14, 15, 16)
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11. A multi-component assembly, comprising:
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a radio frequency (RF) integrated circuit (IC) operable as an RF transceiver; an electrically conductive embedded ground plane (EGP), wherein the EGP includes; a device cavity defining a device cavity perimeter that surrounds the RF IC; and an IPD cavity; an encapsulating material encapsulating the RF IC and the EGP, wherein an active surface of the RF IC, a surface of the EGP, and a surface of the encapsulating material are substantially co-planar and wherein the encapsulating material occupies the IPD cavity; a plurality of interconnect layers defining an inductor, wherein the inductor overlies the encapsulating material occupying the IPD cavity. - View Dependent Claims (12, 13, 17, 18, 19)
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Specification