High performance probe system

• US 7,764,075 B2
• Filed: 10/28/2008
• Issued: 07/27/2010
• Est. Priority Date: 05/08/2002
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A.
• Primary Examiner(s): Hollington; Jermele M
• Application Number:
  US12/259,785
• Publication Number:
  US 20090134895A1
• Time in Patent Office: 637 Days
• Field of Search: None
• US Class Current: 324/762.05
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/31905 Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC'"'"'s I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC'"'"'s pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC'"'"'s pads.

Claims

1. A probe card assembly for providing electrical connection between an integrated circuit tester and a wafer, the probe card assembly comprising:

an interface board comprising a first rigid substrate and a plurality of first electrical contacts arranged to make electrical connection to the integrated circuit tester when the probe card assembly is coupled to the integrated circuit tester;

a probe board comprising a second rigid substrate, a plurality of probes disposed on a surface of the second substrate and arranged to make electrical connections to the wafer when the probe card assembly is brought into contact with the wafer, and a plurality of first electrical paths interconnecting first ones of the probes to corresponding ones of the first electrical contacts of the interface board; and

a flexible cable connected at a first end to the interface board and connected at a second end to the probe board, the flexible cable comprising a plurality of second electrical paths arranged at the first end to make electrical connection to the integrated circuit tester when the probe card assembly is coupled to the integrated circuit tester and electrically connected at the second end to second ones of the probes.

2. The probe card assembly of claim 1, wherein the first end of the flexible cable is disposed in a hole in the interface board.

3. The probe card assembly of claim 2, wherein the first end of the flexible cable comprises a termination block disposed in the hole in the interface board, wherein the termination block holds exposed ends of the second electrical paths in positions corresponding to I/O ports of the integrated circuit tester.

4. The probe card assembly of claim 1, wherein the second electrical paths are attached at the second end of the flexible cable to pads disposed the surface of the second substrate.

5. The probe card assembly of claim 1, further comprising a plurality of flexible cables connected at first ends to the interface board and connected at second ends to the probe board, the flexible cables each comprising a plurality of second electrical paths arranged at the first end to make electrical connection to I/O ports of the integrated circuit tester when the probe card assembly is coupled to the integrated circuit tester and electrically connected at the second ends to second ones of the probes.

6. The probe card assembly of claim 1, further comprising an interposer disposed between the interface board and the probe board, the interposer comprising a plurality of spring contacts disposed within the first electrical paths.

7. A probe card assembly for providing electrical connection between an integrated circuit tester and a wafer, the probe card assembly comprising:

an interface board comprising a first rigid substrate and a plurality of first electrical contacts arranged to make electrical connection to the integrated circuit tester when the probe card assembly is coupled to the integrated circuit tester;

a probe board comprising a second rigid substrate, a plurality of probes disposed on a surface of the second substrate and arranged to make electrical connections to the wafer when the probe card assembly is brought into contact with the wafer, and a plurality of first electrical paths interconnecting first ones of the probes to corresponding ones of the first electrical contacts of the interface board; and

a flexible cable connected at a first end to the interface board and connected at a second end to the probe board, the flexible cable comprising a plurality of second electrical paths arranged at the first end to make electrical connection to the integrated circuit tester when the probe card assembly is coupled to the integrated circuit tester and electrically connected at the second end to second ones of the probes, wherein the first end of the flexible cable comprises a termination block disposed in the hole in the interface board, wherein the first end of the flexible cable is disposed in a hole in the interface board and wherein the termination block holds exposed ends of the second electrical paths in positions corresponding to I/O ports of the integrated circuit tester.