Self-centering braze assembly methods

• US 7,766,216 B2
• Filed: 11/06/2006
• Issued: 08/03/2010
• Est. Priority Date: 06/28/2002
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Daulton, Jay
• Primary Examiner(s): Ward; Jessica L
• Assistant Examiner(s): D'Aniello; Nicholas P
• Application Number:
  US11/557,043
• Publication Number:
  US 20070057025A1
• Time in Patent Office: 1,366 Days
• Field of Search: 228/122.1
• US Class Current: 228/122.1
• CPC Class Codes: A61N 1/36007 of urogenital or gastrointestinal organs, e.g. for incontinence control
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/37217 characterised by the communication link, e.g. acoustic or tactile
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/37235 Aspects of the external programmer
• CPC Class Codes: A61N 1/3727 characterised by the modulation technique
• CPC Class Codes: A61N 1/37276 characterised by means for reducing power consumption during telemetry
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H02J 2310/23 : The load being a medical device, a medical implant, or a life supporting device
• CPC Class Codes: H02J 50/10 : using inductive coupling
• CPC Class Codes: H02J 7/345 : using capacitors as storage or buffering devices
• CPC Class Codes: H04B 5/26 : using coils
• CPC Class Codes: H04B 5/79 : for data transfer in combination with power transfer
• CPC Class Codes: H04L 27/02 : Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation H04L27/32 takes precedence
• CPC Class Codes: H04L 27/10 : Frequency-modulated carrier systems, i.e. using frequency-shift keying H04L27/32 takes precedence
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49945 : by driven force fit
• CPC Class Codes: Y10T 29/49968 : Metal fusion joining
• CPC Class Codes: Y10T 428/12264 : having outward flange, gripping means or interlocking feature
• CPC Class Codes: Y10T 428/12271 : having discrete fastener, marginal fastening, taper, or end structure
• CPC Class Codes: Y10T 428/12347 : Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/12375 : having member which crosses the plane of another member [e.g., T or X cross section, etc.]
• CPC Class Codes: Y10T 428/12396 : Discontinuous surface component
• CPC Class Codes: Y10T 428/12535 : with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12806 : Refractory [Group IVB, VB, or VIB] metal-base component

Abstract

Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Claims

1. A method of brazing an assembly, comprising:

providing a ceramic member with an end, which end is formed without machining and which ceramic member includes zirconia, wherein an external diameter of the ceramic member is constant along a length of the ceramic member;

providing a metal member including titanium and an exterior flange, the exterior flange having a uniform thickness along its length and configured to at least partially encompass the end of the ceramic member, wherein an internal diameter of the exterior flange is constant along a length of the exterior flange and wherein the internal diameter of the external flange is greater than the external diameter of the ceramic member and the thickness of the exterior flange is less than a thickness of an adjacent portion of the metal member;

placing braze material between the metal member and the ceramic member, the braze material including titanium and nickel;

compressing the metal member and the end of the ceramic member formed without machining together with the exterior flange at least partially encompassing the end of the ceramic member;

heating the braze material, the metal member, and the ceramic member in a vacuum until the braze material forms a liquidus; and

cooling the braze material, the metal member, and the ceramic member in the vacuum until the braze material forms a solidus.

2. The method of claim 1 wherein the ceramic member includes a substantially closed end.

3. The method of claim 2, wherein the step of placing the braze material between the metal member and the ceramic member further comprises the step of aligning the metal member with the braze material and the substantially closed end of the ceramic member.

4. The method of claim 2 wherein the substantially closed end is an electrode.

5. The method of claim 4 wherein the electrode further comprises:

a broad-diameter braze surface adjoining the substantially closed-end of the ceramic member.

6. The method of claim 5 wherein the electrode further comprises:

a narrow-diameter pin; and

a stimulating surface with grooves that increase the surface area of the stimulating surface.

7. The method of claim 1 further comprising the following step:

receiving the ceramic member into the exterior flange of the metal member before the steps of compressing, heating, and cooling.

8. The method of claim 7 wherein the exterior flange provides lateral support to ceramic member during the steps of compressing, heating, and cooling.

9. The method of claim 1 wherein the step of placing further includes placing an amount of braze material between the metal member and the ceramic member, which amount of braze material is capable of forming a strong braze bond without exuding from between the metal member and the ceramic member.

19. The method of claim 1, wherein the ceramic member is a cylinder, the metal member is a cylinder having a uniform outer diameter along a length of the metal member, and the outer diameter of the metal member and the inner diameter of the exterior flange are both greater than the outer diameter of the ceramic member.

10. A method of brazing an assembly, comprising:

providing a first metal member including an exterior flange of the first metal member, the exterior flange including an inner surface and a uniform thickness along its length, wherein an internal diameter of the exterior flange is constant along a length of the exterior flange;

providing a braze material including titanium and nickel;

providing a ceramic member including a formed end, wherein an external diameter of the ceramic member is constant along a length of the ceramic member and wherein the internal diameter of the exterior flange is greater than the external diameter of the ceramic member and the thickness of the exterior flange is less than a thickness of an adjacent portion of the metal member;

holding the formed end of the ceramic member adjacent the inner surface of the exterior flange of the first metal member so that the exterior flange at least partially encompasses the formed end of the ceramic member; and

brazing the first metal member to the ceramic member with the braze material where the formed end of the ceramic member and the inner surface of the exterior flange of the first metal member are held together.

11. The method of claim 10 wherein the ceramic member is a substantially close-ended ceramic can and includes a second metal member which forms an end cap to the ceramic member, which end cap completely closes the end of the ceramic can.

12. The method of claim 11 wherein the end cap is an electrode.

13. The method of claim 12 wherein the electrode further comprises:

a broad-diameter braze surface adjoining the substantially closed-end of the ceramic member.

14. The method of claim 13 wherein the electrode further comprises:

a narrow-diameter pin; and

a stimulating surface with grooves that increase the surface area of the stimulating surface.

15. The method of claim 12 wherein the electrode further comprises:

a narrow-diameter pin; and

a stimulating surface with grooves that increase the surface area of the stimulating surface.

16. The method of claim 10 wherein the braze assembly is used to hermetically seal the shell of a microstimulator.

17. The method of claim 10 wherein the exterior flange forms a 90°

angled step with an adjacent portion of the first metal member against which the formed end of the ceramic member may be received, and wherein the surface area between the first metal member and the ceramic member is capable of receiving an adequate amount of braze material to form a strong braze bond.

18. The method of claim 10 wherein the exterior flange provides lateral support to the braze assembly.

20. The method of claim 10, wherein the ceramic member comprises an interior surface and the exterior flange comprises an inner surface, and wherein the interior surface of the portion of the ceramic member encompassed by the exterior flange is parallel to the inner surface of the exterior flange.