Cooling structure for street lamp using light emitting diode

• US 7,766,510 B2
• Filed: 07/17/2008
• Issued: 08/03/2010
• Est. Priority Date: 08/13/2007
• Status: Expired due to Fees

• Current Assignee: Korea Semiconductor Illumination Co., Ltd.
• Original Assignee: Korea Semiconductor Illumination Co., Ltd.
• Inventors: Lee, Young Seb
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US12/218,770
• Publication Number:
  US 20090046458A1
• Time in Patent Office: 747 Days
• Field of Search: None
• US Class Current: 362/249.02
• CPC Class Codes: F21S 45/47 Passive cooling, e.g. using fins, thermal conductive elements or openings
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

Provided is a cooling structure for a street lamp using light emitting diodes. The cooling structure comprises a heat-dissipating case having an installation portion therein, a printed circuit board installed within the installation portion, one or more light emitting diodes installed under the printed circuit board, a heat transfer unit for transferring heat to be generated from the light emitting diodes to the top of the heat-dissipating case and dissipating the heat to the outside, and reflection plates disposed at the bottom of the heat-dissipating case. The cooling structure is efficiently improved to quickly and rapidly dissipate heat generated from the light emitting diodes during turn-on. With this configuration of the cooling structure, the street lamp is protected from failure and has greatly improved durability. In addition, the light emitting structure is improved to inhibit loss of luminance. Therefore, the energy efficiency of the street lamp can be effectively improved.

Claims

1. A cooling structure for a street lamp using light emitting diodes, comprising:

a heat-dissipating case having an installation portion therein and a plurality of cooling fins formed on the upper surface thereof,

a printed circuit board installed within the installation portion,

one or more light emitting diodes installed under the printed circuit board,

a heat transfer unit having through holes formed in portions of the printed circuit board to which the light emitting diodes are coupled, and heat transfer members filled within the respective through holes, and transferring heat to be generated from the light emitting diodes to the top of the heat-dissipating case and dissipating the heat to the outside, and

reflection plates disposed at the bottom of the heat-dissipating case.

2. The cooling structure according to claim 1, wherein the heat transfer unit further includes a plurality of heat transfer plates adhered to the upper surfaces of the heat transfer members.

3. The cooling structure according to claim 2, wherein the heat transfer unit further includes a plurality of heat transfer parts connecting the respective heat transfer plates to the upper portion of the heat-dissipating case.

4. The cooling structure according to claim 3, wherein the heat transfer parts are in the form of pillars made of aluminum.

5. The cooling structure according to claim 4, wherein the heat transfer members are made of lead (Pb).

6. The cooling structure according to claim 1 or 3, wherein the reflection plates are adhered to the respective light emitting diodes and include reflection portions to reflect light from the light emitting diodes.

7. The cooling structure according to claim 6, wherein the angles between the reflection portions are widened downwardly from portions in contact with the light emitting diodes to form flare structures.

8. The cooling structure according to claim 7, wherein each of the reflection plates has an outer surface deposited with aluminum.

9. The cooling structure according to claim 8, wherein each of the reflection plates includes a heat-dissipating fin formed between the adjacent reflection portions.

10. The cooling structure according to claim 6, further comprising an auxiliary heat-dissipating plate adhered to the upper surface of the heat-dissipating case.

11. The cooling structure according to claim 10, further comprising a plurality of cooling fins formed on the upper surface of the auxiliary heat-dissipating plate.

12. The cooling structure according to claim 11, wherein the auxiliary heat-dissipating plate is secured to the heat-dissipating case by one or more screws.

13. The cooling structure according to claim 6, further comprising a transparent protective cover provided under the heat-dissipating case.

14. The cooling structure according to claim 6, wherein the reflection plates have greater vertical lengths than the light emitting diodes.