Encapsulated devices and method of making

• US 7,767,498 B2
• Filed: 08/24/2006
• Issued: 08/03/2010
• Est. Priority Date: 08/25/2005
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Vitex Systems, Inc.
• Inventors: Krajewski, Todd L., Moro, Lorenza
• Primary Examiner(s): Graybill; David E
• Application Number:
  US11/509,837
• Publication Number:
  US 20070049155A1
• Time in Patent Office: 1,440 Days
• Field of Search: None
• US Class Current: 438/126
• CPC Class Codes: H10K 30/88 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

A method of encapsulating an environmentally sensitive device. The method includes providing a substrate; placing at least one environmentally sensitive device adjacent to the substrate; and depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from at least one polymer precursor, and wherein the polymeric decoupling layer has at least one of: a reduced number of polar regions; a high packing density; a reduced number of regions that have bond energies weaker than a C—C covalent bond; a reduced number of ester moieties; increased Mw of the at least one polymer precursor; increased chain length of the at least one polymer precursor; or reduced conversion of C═C bonds. An encapsulated environmentally sensitive device is also described.

Claims

1. A method of encapsulating an environmentally sensitive device comprising:

providing a substrate;

placing at least one environmentally sensitive device adjacent to the substrate; and

depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from a polymer precursor blend comprising;

about 60 to about 90 wt % of a dimethacrylate;

0 to about 20 wt % of a monoacrylate;

0 to about 20 wt % of a triacrylate; and

about 1 to about 10% of a photoinitiator.

2. The method of claim 1 wherein the polymeric decoupling layer has no more than about 8×

10²⁰ n/ml of ether linkages.

3. The method of claim 1 wherein the polymer precursor blend has an average molecular weight of at least about 275.

4. The method of claim 1 wherein at least one polymer precursor has a functionalized hydrocarbon backbone.

5. The method of claim 4 wherein the backbone is saturated.

6. The method of claim 4 wherein the backbone is unsaturated.

7. The method of claim 1 wherein the polymeric decoupling layer has no more than about 4.0×

10²¹ n/ml side chains.

8. The method of claim 1 wherein at least one polymer precursor has a functionalized hydrocarbon backbone, and wherein the polymeric decoupling layer has no more than about 8×

10²⁰ n/ml of ether linkages.

9. The method of claim 8 wherein the hydrocarbon backbone is saturated.

10. The method of claim 8 wherein the hydrocarbon backbone is unsaturated.

11. The method of claim 8 wherein the polymeric decoupling layer has no more than about 4.0×

10²¹ n/ml side chains.

12. The method of claim 8 wherein the polymer precursor blend has an average molecular weight of at least about 275.

13. The method of claim 1 wherein the dimethacrylate is present in an amount of about 65 to about 75 wt %.

14. The method of claim 1 wherein the monoacrylate is present in an amount of about 10 to about 20 wt %.

15. The method of claim 1 wherein the triacrylate is present in an amount of about 5 to about 15 wt %.

16. The method of claim 1 wherein the photoinitiator is present in an amount of about 1 to about 3 wt %.

17. The method of claim 1 wherein the at least one polymer precursor comprises:

about 65 to about 75 wt % dodecane dimethacrylate;

about 10 to about 20 wt % lauryl acrylate;

about 5 to about 15 wt % trimethylolpropane triacrylate;

about 1 to about 3 wt % of a photoinitiator.

18. A method of encapsulating an environmentally sensitive device comprising:

providing a substrate;

placing at least one environmentally sensitive device adjacent to the substrate; and

depositing at least one barrier stack adjacent to the environmentally sensitive device, the at least one barrier stack comprising at least one barrier layer and at least one polymeric decoupling layer, wherein the at least one polymeric decoupling layer is made from a polymer precursor blend comprising;

about 60 to about 90 wt % of a dimethacrylate;

0 to about 20 wt % of a monoacrylate;

0 to about 20 wt % of a triacrylate; and

about 1 to about 10% of a photoinitiator;

and wherein the polymeric decoupling layer has no more than about 8×

10²⁰ n/ml of ether linkages and no more than about 4.0×

10²¹ n/ml side chains.