Plasma immersion ion implantation reactor having an ion shower grid
First Claim
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1. A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece, comprising:
- providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid;
placing a workpiece in said process region;
furnishing said selected species into said ion generation region;
evacuating said process region;
applying plasma source power to generate a plasma of said selected species in said ion generation region, and applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region;
applying an RF bias voltage to said workpiece, said RF bias voltage corresponding to said desired ion implantation profile, whereby to implant said ions into said workpiece at a depth below a surface of the workpiece according to said ion implantation depth profile; and
adjusting ion energy at said workpiece surface by adjusting the frequency of said RF bias voltage.
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Abstract
A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece is carried out in a reactor chamber with an ion shower grid that divides the chamber into an upper ion generation region and a lower process region, the ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of the ion shower grid.
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Citations
67 Claims
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1. A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece, comprising:
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providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid; placing a workpiece in said process region; furnishing said selected species into said ion generation region; evacuating said process region; applying plasma source power to generate a plasma of said selected species in said ion generation region, and applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region; applying an RF bias voltage to said workpiece, said RF bias voltage corresponding to said desired ion implantation profile, whereby to implant said ions into said workpiece at a depth below a surface of the workpiece according to said ion implantation depth profile; and adjusting ion energy at said workpiece surface by adjusting the frequency of said RF bias voltage. - View Dependent Claims (2, 3, 4, 5, 6, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67)
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7. A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece, comprising:
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providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid; placing a workpiece in said process region; furnishing said selected species into said ion generation region; evacuating said process region; applying plasma source power to generate a plasma of said selected species in said ion generation region, and applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region; applying an RF bias voltage to said workpiece, said RF bias voltage corresponding to said desired ion implantation profile, whereby to implant said ions into said workpiece at a depth below a surface of the workpiece according to said ion implantation depth profile; and providing neutralization electrons in the vicinity of said workpiece by generating a flow of electrons from an electron gun toward said workpiece surface.
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8. A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece, comprising:
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providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid; placing a workpiece in said process region; furnishing said selected species into said ion generation region; evacuating said process region; applying plasma source power to generate a plasma of said selected species in said ion generation region, and applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region; applying an RF bias voltage to said workpiece, said RF bias voltage corresponding to said desired ion implantation profile, whereby to implant said ions into said workpiece at a depth below a surface of the workpiece according to said ion implantation depth profile; and providing neutralization electrons in the vicinity of said workpiece by injecting an electron-donor gas into said process region and near said workpiece.
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9. A plasma immersion ion implantation process for implanting a selected species at a desired ion implantation depth profile in a workpiece, comprising:
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providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural elongate orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid; placing a workpiece in said process region; furnishing said selected species into said ion generation region; evacuating said process region; applying plasma source power to generate a plasma of said selected species in said ion generation region, and applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region; applying an RF bias voltage to said workpiece, said RF bias voltage corresponding to said desired ion implantation profile, whereby to implant said ions into said workpiece at a depth below a surface of the workpiece according to said ion implantation depth profile; and wherein the step of applying plasma source power comprises generating a torroidal plasma current in said ion generation region through an external reentrant conduit coupled across said ion generation region, and the step of applying said grid potential comprises applying a grid potential between said plasma and said ion shower grid. - View Dependent Claims (10, 11, 12, 13)
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Specification