Pre-molded clip structure
First Claim
Patent Images
1. A premolded clip structure comprising:
- a first clip comprising a first die attach surface;
a second clip comprising a second die attach surface; and
a molding material coupled to the first clip and the second clip, and comprising a molding material surface, wherein the first and second die attach surfaces are exposed through the molding material surface, and wherein the first and second die attach surfaces are exposed by the molding material surface.
7 Assignments
0 Petitions
Accused Products
Abstract
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
114 Citations
16 Claims
-
1. A premolded clip structure comprising:
-
a first clip comprising a first die attach surface; a second clip comprising a second die attach surface; and a molding material coupled to the first clip and the second clip, and comprising a molding material surface, wherein the first and second die attach surfaces are exposed through the molding material surface, and wherein the first and second die attach surfaces are exposed by the molding material surface. - View Dependent Claims (2, 16)
-
-
3. A semiconductor die package comprising:
-
a premolded clip structure comprising a first clip comprising a first surface, a second clip comprising a second surface, and a molding material coupled to the first clip and the second clip, wherein the first and second surfaces are exposed through the molding material; and a semiconductor die comprising a first die surface and a second die surface, and a first electrical terminal and a second electrical terminal at the first die surface, wherein the first surface is electrically coupled to the first electrical terminal and the second surface is electrically coupled to the second electrical terminal, wherein the molding material is a first molding material, and wherein the semiconductor die package further comprises a second molding material around at least a portion of the semiconductor die, the premolded clip structure, and the leadframe structure, wherein an interface is present between the first molding material and the second molding material. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
Specification