Card adapter for use with a storage apparatus

• US 7,768,111 B2
• Filed: 01/04/2008
• Issued: 08/03/2010
• Est. Priority Date: 03/26/1998
• Status: Expired due to Fees

• Current Assignee: Toshiba Memory Corporation (Kioxia Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Iwasaki, Hiroshi
• Primary Examiner(s): Williams; Alexander O
• Application Number:
  US12/007,002
• Publication Number:
  US 20080117586A1
• Time in Patent Office: 942 Days
• Field of Search: 257/679, 257/396, 257/390, 257/391, 257/209, 257/415, 257/680, 257/315, 257/773, 257/488, 257/492, 257/380, 257/382, 235/488, 235/492, 235/380, 235/382, 235/487, 235/486, 365/52.51, 365/63, 365/185.11, 365/185.33
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.

Claims

1. A card adapter for use with a storage apparatus, the storage apparatus having a thickness of 1.4 mm ±

0.1 mm and having a first surface and a second surface, a flat type external connection terminal disposed on the first surface, a flash memory in the storage apparatus, and a marker formed on the second surface of the storage apparatus representing an inserting direction of the storage apparatus, the storage apparatus being adapted to a first host device to enable the first host device to access the storage apparatus, the card adapter comprising;

a body member having a recess adapted to receive the storage apparatus, the body member being formed to be placed at a second host device different from the first host device, the body member being configured to enable the second host device to access the storage apparatus.

2. The card adapter as set forth in claim 1, wherein the recess of said body member fits said storage apparatus in such a manner that at least a part of said storage apparatus is exposed.

3. The card adapter set forth in claim 1, wherein a depth of the recess of said body member is larger than the thickness of said storage apparatus.

4. The card adapter as set forth in claim 1, wherein the body member has a first portion and a second portion, wherein the storage apparatus is detachable from the first portion, and

wherein the second portion detachably receives the first portion.

5. The card adapter as set forth in claim 4, wherein the recess is a concave portion of the first portion.

6. The card adapter as set forth in claim 1, wherein the storage apparatus is configured to output data stored in the flash memory without using the body member.