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Stackable tier structure comprising prefabricated high density feedthrough

  • US 7,768,113 B2
  • Filed: 05/26/2006
  • Issued: 08/03/2010
  • Est. Priority Date: 05/26/2005
  • Status: Active Grant
First Claim
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1. A tier structure comprising:

  • a tier frame including a first tier side, a second tier side, and an integrated circuit die that comprises an I/O pad and a feedthrough structure, wherein the feedthrough structure includes a conductive structure configured to route electrical signals between the first tier side and the second tier side, and wherein the I/O pad is electrically connected to the conductive structure by a conductive trace;

    an exposed electrically conductive pad disposed on the first tier side or the second tier side, wherein the exposed electrically conductive pad is electrically connected to the conductive structure; and

    a conductive metallized polymer column disposed on the exposed electrically conductive pad, wherein the conductive metallized polymer column includes a photoresist, and wherein the exposed electrically conductive pad is configured for electrical connection to another tier frame.

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