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Multi-chip package system

  • US 7,768,125 B2
  • Filed: 01/04/2006
  • Issued: 08/03/2010
  • Est. Priority Date: 01/04/2006
  • Status: Active Grant
First Claim
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1. A method for manufacturing a chip package system comprising:

  • providing a chip having interconnects provided thereon;

    forming a molding compound on the chip and encapsulating the interconnects; and

    forming a groove in the molding compound and the interconnects to expose the interconnects and the molding compound in a coplanar surface.

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