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Integrated antenna and chip package and method of manufacturing thereof

  • US 7,768,457 B2
  • Filed: 02/15/2008
  • Issued: 08/03/2010
  • Est. Priority Date: 06/22/2007
  • Status: Active Grant
First Claim
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1. An integrated antenna and chip package comprising:

  • a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material;

    a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material;

    an antenna disposed on the second substrate;

    a communication device coupled to the antenna, wherein the communication device is disposed on the second substrate;

    a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough; and

    a sensor electrically coupled to the first substrate and positioned adjacent to the communication device, the sensor configured to measure a temperature of the communication device.

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