Integrated antenna and chip package and method of manufacturing thereof

• US 7,768,457 B2
• Filed: 02/15/2008
• Issued: 08/03/2010
• Est. Priority Date: 06/22/2007
• Status: Active Grant

• Current Assignee: Vubiq Networks, Inc.
• Original Assignee: Vubiq, Inc.
• Inventors: Pettus, Michael Gregory, Bardeen, James Robert Amos
• Primary Examiner(s): Nguyen; Hoang V
• Application Number:
  US12/070,281
• Publication Number:
  US 20090207090A1
• Time in Patent Office: 900 Days
• Field of Search: 343/700.MS, 343/872, 343/909
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6633 Transition between different waveguide types
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01P 1/30 for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability H01P1/04, H01P1/08 take precedence
• CPC Class Codes: H01P 3/026 Coplanar striplines [CPS]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/30 Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/045 with particular feeding means for circular polarisation H01Q9/0428
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.

Claims

1. An integrated antenna and chip package comprising:

a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material;

a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material;

an antenna disposed on the second substrate;

a communication device coupled to the antenna, wherein the communication device is disposed on the second substrate;

a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough; and

a sensor electrically coupled to the first substrate and positioned adjacent to the communication device, the sensor configured to measure a temperature of the communication device.

2. The package of claim 1, wherein the second substrate is comprised of quartz.

3. The package of claim 1, wherein the lens is a radiation lens positioned above the antenna, the lid further comprises a shoulder portion configured to be in thermal contact with the communication device, the shoulder portion configured to transfer heat from the communication device.

4. The package of claim 3, wherein the shoulder portion is made of copper.

5. The package of claim 1, wherein the antenna further comprises a plurality of antennas positioned horizontally adjacent to one another on the second substrate, wherein at least two antennas are spaced apart a one-half wavelength.

6. The package of claim 1, wherein the communication device comprises a connecting terminal located between a bottom surface of the communicating device and the second substrate, wherein the antenna and the connecting terminal are substantially on the same plane.

7. The package of claim 1, wherein the antenna is a full-wave di-patch antenna further comprising:

a common differential feed point having a positive terminal and a negative terminal coupled to the communication device;

a differential feed line pair comprising a first feed line having a distal end coupled to the positive terminal and a second feed line having a distal end coupled to the negative terminal, wherein the first and second feed lines are adjacent to one another at the distal end;

a first patch antenna connected to a proximal end of the first feed line;

a second patch antenna connected to a proximal end of the second feed line, the first patch antenna and the second patch antenna are spaced a full guide wavelength apart, wherein the first and second patch antennas are configured to maximize energy transfer efficiency therebetween to operate as a single full-wave structure.

8. The package of claim 7, wherein the current and voltage delivered to the feed points of the first and second patch antennas are 180 degrees out of phase with respect to one another individually and in phase with one another with respect to the antennas.

9. A method for manufacturing an antenna package, the method comprising:

selecting a first substrate having a first surface and a second surface;

coupling a second substrate onto the first surface of the first substrate, the second substrate being made of a dielectric material, wherein the second substrate is in electrical communication with the first substrate;

disposing an antenna on the second substrate;

coupling a communication device onto the second substrate, wherein the communication device is electrically coupled to the antenna;

attaching a lid to the first substrate to encapsulate the antenna and the communication device therein, the lid having a cavity configured to allow radiation from the antenna to be emitted through the lid; and

coupling a sensor to the communication device, wherein the sensor is configured to measure a temperature of the communication device.

10. The method of claim 9, wherein the antenna is a full wave di-patch antenna.

11. The method of claim 9, wherein the antenna is disposed such that the antenna is in a substantially same plane as a connecting terminal located on a bottom surface of the communicating device.

12. The method of claim 9, wherein the lid comprises a shoulder portion configured to be in thermal contact with the communication device, the shoulder portion configured to transfer heat from the communication device.

13. The method of claim 9, wherein the shoulder portion is made of copper.