Compact lens turret assembly

• US 7,768,574 B2
• Filed: 05/04/2005
• Issued: 08/03/2010
• Est. Priority Date: 05/04/2004
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Humpston, Giles
• Primary Examiner(s): Tran; Sinh
• Assistant Examiner(s): Pasiewicz; Daniel M
• Application Number:
  US11/121,434
• Publication Number:
  US 20050248680A1
• Time in Patent Office: 1,917 Days
• Field of Search: 348/335, 348/340, 348373-376, 257290-291, 257/294
• US Class Current: 348/374
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Abstract

An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.

Claims

1. A camera module comprising:

(a) a sensor unit including a semiconductor chip having a front surface facing in a forward direction with an imaging area and an imaging circuit adapted to generate signals representative of an optical image impinging on said imaging area, said sensor unit also including a cover having a transparent area aligned with said imaging area, said cover overlying said front surface and being secured to said chip, said cover having an outer surface facing in the forward direction away from said chip, said sensor unit having one or more alignment features exposed at said outer surface, said one or more alignment features being in predetermined spatial relationship to said imaging area of said chip, said sensor unit further having contacts electrically connected to the imaging circuit; and

(b) an optical unit including one or more optical elements, said optical unit having one or more engagement features engaged with said one or more alignment features of said sensor unit so that the engaged features position said optical elements relative to said imaging area of said chip in the forward direction so as to control the distance in the forward direction between the optical elements and the sensor unit; and

(c) a circuit panel having conductors, said circuit panel extending between said optical unit and said cover but not extending between said engagement features of said optical unit and said alignment features of said unit, at least some of said contacts being electrically connected to at least some of said conductors of said circuit panel.

2. The module as claimed in claim 1 wherein said one or more alignment features engaged with said one or more alignment features of said sensor unit include at least a part of said outer surface of said cover facing in said forward direction.

3. The module as claimed in claim 2 wherein said outer surface of said cover includes a substantially planar region facing in said forward direction and said one or more engagement features of said optical unit include one or more rear elements defining a substantially planar rear engagement surface engaged with said substantially planar region of said outer surface facing in said forward direction.

4. The module as claimed in claim 3 wherein said rear elements of said optical unit are offset from said contacts.

5. The module as claimed in claim 4 wherein said optical unit includes a turret supporting said one or more optical elements, said turret defining said engagement features of said optical unit.

6. The module as claimed in claim 5 wherein said turret includes electrically conductive pads facing toward said sensor unit, said pads being offset from said one or more rear elements, at least some of said contacts being electrically connected to at least some of said pads.

7. The module as claimed in claim 6 further comprising a socket having electrically conductive elements, said module being releasably engaged in said socket, at least some of said terminals being in electrical contact with at least some of said electrically conductive elements of said socket.

8. The module as claimed in claim 1 wherein said one or more alignment features of said sensor unit include one or more elements projecting forwardly from said outer surface of said cover.

9. The module as claimed in claim 8 wherein at least some of said projecting elements are electrically conductive contacts electrically connected to said chip.

10. The module as claimed in claim 9 wherein said optical unit includes a turret supporting said optical elements and wherein said engagement features of said optical unit include electrically conductive pads on said turret facing toward said unit, at least some of said contacts being mechanically engaged with at least some of said pads and electrically connected to at least some of said pads.

11. The module as claimed in claim 10 wherein said turret has an exterior surface and one or more terminals exposed at said exterior surface, at least some of said terminals being electrically connected to at least some of said pads.

12. The module as claimed in claim 11 wherein said turret and said unit are constructed and arranged so that the module is adapted to be releasably engaged in a socket with at least some of said terminals in releasable electrical contact with at least some electrically conductive elements of said socket.

13. The module as claimed in claim 1 wherein said imaging area of said chip is substantially planar, said optical elements are arranged along an optical axis and said engaged features position said optical unit so that said optical axis is substantially perpendicular to said imaging area.

14. The module as claimed in claim 1 wherein said optical unit includes a turret supporting said one or more optical elements, said turret and said sensor unit each having horizontal area in a plane perpendicular to said forward direction, the horizontal area of said turret being 1.2 times the horizontal area of said sensor unit or less.

15. The module as claimed in claim 14 wherein said chip has a horizontal area and wherein the horizontal area of said turret is 1.2 times the horizontal area of said chip or less.

16. The module as claimed in claim 14 wherein said horizontal area of said turret is equal to or less than the horizontal area of said sensor unit.

17. The module as claimed in claim 1 wherein said one or more optical elements include one or more lenses.

18. The module as claimed in claim 1 wherein said imaging area of said chip is substantially planar, said optical elements are arranged along an optical axis and said engaged features position said optical unit so that said optical axis is substantially perpendicular to said imaging area.

19. The camera module as claimed in claim 1 wherein said circuit panel has one or more apertures therein and at least some of said engagement features of said optical unit, said alignment features of said sensor unit or both extend through said one or more apertures.

20. The camera module as claimed in claim 1 wherein said optical elements include at least one lens positioned forwardly of said circuit panel.