System-in-package wireless communication device comprising prepackaged power amplifier

• US 7,769,355 B2
• Filed: 06/14/2005
• Issued: 08/03/2010
• Est. Priority Date: 01/19/2005
• Status: Active Grant

• Current Assignee: Micro Mobio Corporation
• Original Assignee: Micro Mobio Corporation
• Inventors: Ichitsubo, Ikuroh, Liu, Wen Chung, Kubota, Kanya
• Primary Examiner(s): Urban; Edward
• Assistant Examiner(s): HU, RUI MENG
• Application Number:
  US11/152,308
• Publication Number:
  US 20060160504A1
• Time in Patent Office: 1,876 Days
• Field of Search: 455/127.1, 455/127.2, 455/90.3, 455/128, 455/126, 330/126, 330/254, 330/140, 257/692
• US Class Current: 455/127.1
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03F 1/0272 : by using a signal derived from the output signal
• CPC Class Codes: H03F 1/34 : Negative-feedback-circuit arrangements with or without positive feedback H03F1/02 - H03F1/30, H03F1/38 - H03F1/50, H03F3/50 take precedence ; for rejection of common mode signals H03F3/45479
• CPC Class Codes: H03F 2200/294 : the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 : Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 3/195 : in integrated circuits
• CPC Class Codes: H03F 3/24 : of transmitter output stages
• CPC Class Codes: H03G 3/3042 : in modulators, frequency-changers, transmitters or power amplifiers transmission power control in bidirectional transmission systems H04W52/04
• CPC Class Codes: H04B 2001/0433 : with linearisation using feedback
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/16 : incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/041 : Stacked PCBs, i.e. having neither an empty space nor mounted components in between
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: H05K 3/3442 : having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

A substantially rectangular shaped power amplifier module includes a power amplifier for amplifying radio frequency signals, a bias control terminal and a power sensing terminal disposed on the same side of the power amplifier module, an input terminal and a ground terminal disposed on the same side of the power amplifier module, and an output terminal and one or more power supply terminals disposed on the same side of the power amplifier module.

Claims

1. A system-in-package wireless communication device, comprising:

a system-in-package substrate;

a transceiver mounted on the system-in-package substrate and configured to convert an input electric signal to a radio frequency signal;

a system-in-package enclosure configured to encapsulate at least the transceiver and part of the system-in-package substrate, wherein the system-in-package enclosure comprises a window;

a prepackaged power amplifier module mounted on the system-in-package substrate and under the window in the system-in-package enclosure, the prepackaged power amplifier module comprising;

a single-die substrate mounted on the system-in-package substrate;

a power amplifier die on the single-die substrate, the power amplifier die comprising a power amplifier circuit configured to produce an amplified radio frequency signal in response to the radio frequency signal and a power sensing circuit configured to detect the amplified radio frequency signal and to output a power sensing signal; and

a prepackage enclosure configured to encapsulate the power amplifier die on the single-die substrate, wherein the prepackage enclosure is exposed to the ambient environment through the window in the system-in-package enclosure; and

a base band processor mounted on the system-in-package substrate, wherein the base band processor is connected with the power sensing circuit and is configured to receive a power sensing signal from the power sensing circuit, the base band processor being configured to send the input electric signal to the transceiver.

2. The system-in-package wireless communication device of claim 1, wherein the prepackage enclosure is fully exposed to the ambient environment through the window in the system-in-package enclosure.

3. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module is encapsulated inside the system-in-package enclosure.

4. The system-in-package wireless communication device of claim 1, wherein the system-in-package substrate comprises first electric interconnects configured to be electrically coupled to the power amplifier circuit.

5. The system-in-package wireless communication device of claim 4, wherein the single-die comprises second electric interconnects that are electrically coupled to the power amplifier circuit.

6. The system-in-package wireless communication device of claim 5, wherein the second electric interconnects are configured to be electrically connected to the first electric interconnects when the single-die is mounted onto the system-in-package substrate.

7. The system-in-package wireless communication device of claim 4, wherein the prepackaged power amplifier module comprises wire bonds configured to electrically connect the power amplifier circuit to the second electric interconnects in the single-die.

8. The system-in-package wireless communication device of claim 7, wherein the second electric interconnects are positioned on a first surface of the single-die, wherein a second surface of the single-die opposing to the first surface is in contact of the system-in-package substrate when the single-die is mounted onto the system-in-package substrate.

9. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module has been tested to be capable of amplifying radio-frequency signals before the prepackaged power amplifier module is mounted onto the system-in-package substrate.

10. The system-in-package wireless communication device of claim 1, further comprising a digital control unit in the prepackaged power amplifier module and configured to produce a bias control signal to be received by the power amplifier circuit.

11. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module further comprises:

a bias control terminal configured to receive a bias control signal;

an input terminal configured to receive the input radio frequency signal;

a ground terminal electrically connected to the ground of the power amplifier circuit, wherein the input terminal and the ground terminal are disposed on the same side of the power amplifier die;

an output terminal configured to output the amplified radio frequency signal; and

one or more power supply terminals configured to receive power to be supplied to the power amplifier circuit.

12. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module further comprises a power sensing terminal configured to output the power sensing signal to be received by the base band processor on the system-in-package substrate.

13. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module is substantially rectangular shaped, wherein the prepackaged power amplifier module further comprises nine electric terminals positioned along three sides of the power amplifier die, wherein the nine electric terminals are configured to receive power and the radio frequency signal and to output the amplified radio frequency signal, and wherein a fourth side of the power amplifier die does not comprise an electric terminal.

14. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module is substantially rectangular shaped, wherein the prepackaged power amplifier module further comprises a power supply terminal and an output terminal positioned along a same side of the power amplifier die, wherein the power supply terminal is configured to receive power for the power amplifier circuit, wherein the output terminal is configured to output the amplified radio frequency signal.

15. The system-in-package wireless communication device of claim 1, wherein the prepackaged power amplifier module comprises an impedance matching circuit configured to receive the input radio frequency signal.

16. A system-in-package wireless communication device, comprising:

a system-in-package substrate comprising first electric interconnects;

a transceiver mounted on the system-in-package substrate and configured to convert an input electric signal to a radio frequency signal;

a prepackaged power amplifier module mounted on the system-in-package substrate, wherein the prepackaged power amplifier module comprises;

a single-die substrate mounted on the system-in-package substrate, wherein the single-die substrate comprises second electric interconnects on a top surface of the single-die substrate, wherein the single-die substrate comprises a plurality of pads on a bottom surface of the single-die substrate and a conductive grounding island in the center of the bottom surface of the single-die substrate; and

a power amplifier die on the single-die substrate, the power amplifier die comprising a power amplifier circuit electrically coupled to the second electric interconnects by wire bonding and a power sensing circuit configured to detect the amplified radio frequency signal and to output a power sensing signal, wherein the power amplifier circuit is configured to produce an amplified radio frequency signal in response to the radio frequency signal, wherein the second electric interconnects are configured to be electrically connected to the first electric interconnects when the single-die substrate is mounted onto the system-in-package substrate;

a system-in-package enclosure configured to encapsulate at least the transceiver on the system-in-package substrate, wherein the system-in-package enclosure comprises a window configured to expose the prepackaged power amplifier module to the ambient environment; and

a base band processor mounted on the system-in-package substrate, the base band processor being configured to send the input electric signal to the transceiver.

17. The system-in-package wireless communication device of claim 16, wherein the second electric interconnects are positioned on a first surface of the single-die substrate, wherein a second surface of the single-die substrate opposing to the first surface is in contact of the system-in-package substrate when the single-die substrate is mounted onto the system-in-package substrate.

18. The system-in-package wireless communication device of claim 16, wherein the power amplifier die in the prepackaged power amplifier module comprises an impedance matching circuit configured to receive the input radio frequency signal.

19. The system-in-package wireless communication device of claim 16, wherein the prepackaged power amplifier module is substantially rectangular shaped, wherein the prepackaged power amplifier module further comprises nine electric terminals positioned along three sides of the power amplifier die, and wherein a fourth side of the power amplifier die does not comprise an electric terminal.

20. The system-in-package wireless communication device of claim 16, wherein the prepackaged power amplifier module is substantially rectangular shaped, wherein the prepackaged power amplifier module further comprises a power supply terminal and an output terminal positioned along a same side of the power amplifier die, wherein the power supply terminal is configured to receive power for the power amplifier circuit, wherein the output terminal is configured to output the amplified radio frequency signal.

21. The system-in-package wireless communication device of claim 16, wherein the prepackaged power amplifier module is substantially rectangular shaped, wherein the prepackaged power amplifier module further comprises an input terminal and a ground terminal positioned along a same side of the power amplifier die, wherein the input terminal is configured to receive the radio frequency signal.

22. The system-in-package wireless communication device of claim 16, wherein the prepackaged power amplifier module comprises an electrical terminal configured to receive power, the radio frequency signal, or a control signal, or to output the amplified radio frequency signal.

23. The system-in-package wireless communication device of claim 16, wherein the prepackaged power amplifier module further comprises a prepackage enclosure configured to encapsulate the power amplifier die.

24. A system-in-package wireless communication device, comprising:

a system-in-package substrate comprising first electric interconnects;

a transceiver mounted on the system-in-package substrate and configured to convert an input electric signal to a radio frequency signal;

a base band processor mounted on the system-in-package substrate, the base band processor being configured to send the input electric signal to the transceiver;

a system-in-package enclosure configured to encapsulate at least the transceiver on the system-in-package substrate, wherein the system-in-package enclosure comprises a window configured to expose the prepackaged power amplifier module to the ambient environment; and

a prepackaged power amplifier module mounted on the system-in-package substrate, wherein the prepackaged power amplifier module comprises;

a single-die substrate comprising second electric interconnects and mounted on the system-in-package substrate on a top surface of the single-die substrate, wherein the single-die substrate comprises a plurality of pads on the center of a bottom surface of the single-die substrate and a conductive grounding island in the center of the bottom surface of the single-die substrate;

a power amplifier die on the single-die substrate, wherein the power amplifier die is substantially rectangular shaped and comprises a power amplifier circuit that is electrically coupled to the second electric interconnects and is configured to produce an amplified radio frequency signal in response to the radio frequency signal, wherein the power amplifier die comprises a power sensing circuit configured to detect the amplified radio frequency signal and to output the power sensing signal, wherein the second electric interconnects are configured to be electrically connected to the first electric interconnects when the single-die substrate is mounted onto the system-in-package substrate wherein the conductive grounding island on a bottom surface of the single-die substrate is positioned underneath the power amplifier die; and

a prepackage enclosure configured to encapsulate the power amplifier die on the single-die substrate.