Modular capillary pumped loop cooling system

• US 7,770,630 B2
• Filed: 08/26/2003
• Issued: 08/10/2010
• Est. Priority Date: 09/20/2001
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Faneuf, Barrett M., Chesser, Jason B., Montgomery, Stephen W.
• Primary Examiner(s): Bianco; Patricia M
• Assistant Examiner(s): PATEL, NIHIR B
• Application Number:
  US10/648,170
• Publication Number:
  US 20040040695A1
• Time in Patent Office: 2,541 Days
• Field of Search: 165/104.26, 165/80.3, 165/104.33, 165/121, 165/122, 165/104.13, 361/687, 361/700, 257/715
• US Class Current: 165/65
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/20009 using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

A modular capillary pump loop (CPL) cooling system and associated components. The modular CPL cooling system transfers heat from high-power circuit components, such as microprocessors disposed within computer chassis, to other locations within or external to the chassis, where the heat can be more easily removed. In various embodiments, the CPL cooling system includes one or more evaporators connected to one or more condensers via flexible liquid transport and vapor transport lines. A wicking structure, such as a volume of sintered copper, is disposed within each condenser. The wicking structure draws working fluid (e.g., water) in a liquid state into the evaporator based on a capillary mechanism and a pressure differential across a meniscus/vapor interface on an upper surface of the wicking structure. As the liquid meniscus is evaporated, additional fluid is drawn into the evaporator. The working fluid is then condensed back into a liquid in the condenser.

Claims

1. A thin-profile condenser, comprising:

a cover plate;

a channeled base member having an external wall extending around a periphery thereof to which a cover plate is secured so as to define a sealed cavity;

a pair of capillary walls, each capillary wall including a portion disposed substantially adjacent to a portion of the external wall so as to define a pair of capillary channels, said capillary walls dividing the sealed cavity into a condensing region and the capillary channels;

a pair of inner walls, each internal wall coupled to a corresponding one of the pair of capillary walls to create a thermal isolation area between each inner wall and its corresponding capillary wall, wherein there is neither liquid nor vapor in the thermal isolation areas;

a vapor inlet port to receive a working fluid in a vapor state operatively coupled to the sealed cavity; and

a first liquid output port from which the working fluid exits the condenser, operatively coupled to an outlet end of each capillary channel.

2. The thin-profile condenser of claim 1, further comprising a charge port operatively coupled to the condenser to enable the condenser to be charged with the working fluid.

3. The thin-profile condenser of claim 1, further comprising a hole extending through the condensing region.

4. The thin-profile condenser of claim 1, wherein said at least one internal wall includes portions that are configured symmetrically so as to form a centrally-disposed condensing region connected to a first capillary channel disposed on a first side of the condensing region and a second capillary channel disposed on a second side of the condensing region opposite of the first side.

5. The thin-profile condenser of claim 1, further comprising a second liquid outlet port operatively coupled to an outlet end of the second capillary channel.

6. The thin-profile condenser of claim 1, further comprising a plurality of posts disposed within the condensing region extending between the channeled base member and the cover plate.

7. The thin-profile condenser of claim 1, further comprising a heatsink thermally coupled to the cover plate.

8. The thin-profile condenser of claim 7, wherein the heatsink comprises a base plate having a plurality of pins extending upward therefrom.

9. The thin-profile condenser of claim 7, further comprising a centrifugal fan including an annular fan rotor having a plurality of fan blades disposed around a periphery of the heatsink so as to draw air across the heatsink when rotated.