Electronic device and method of manufacturing the same

• US 7,772,025 B2
• Filed: 09/27/2007
• Issued: 08/10/2010
• Est. Priority Date: 10/02/2006
• Status: Expired due to Fees

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Arao, Osamu, Shintai, Akira, Saitoh, Takashige
• Primary Examiner(s): Andújar; Leonardo
• Assistant Examiner(s): KLEIN, JORDAN M
• Application Number:
  US11/902,984
• Publication Number:
  US 20080081150A1
• Time in Patent Office: 1,048 Days
• Field of Search: 257/213, 257/252, 257/254, 257/414, 257/417, 257/678, 257/415, 257/419, 257/777, 257/783, 257/E23.085, 735/041.5, 735/140.2, 735/142.9, 735/143.2, 438/48, 438/50, 438/51, 438/53
• US Class Current: 438/50
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: Y10T 428/24355 : Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Abstract

An electronic device includes an electronic element having a detecting part on one surface thereof, a base member, bumps, and an adhesive film. The base member is arranged to face the one surface of the electric element. The bumps are arranged between the electric element and the base member for electrically coupling the electric element and the base member. The adhesive film is attached to the one surface of the electronic element and has an electronic insulating property. In addition, the adhesive film has a hollow part at a portion corresponding to the detecting part in a manner separated from the detecting part. Furthermore, a first pressure in the hollow part is higher than a second pressure outside the hollow part.

Claims

1. A manufacturing method of an electronic device, comprising:

preparing an electronic element having a detecting part on one surface thereof and a base member;

attaching an adhesive film having an electronic insulating property on the one surface of the electronic element and forming a hollow part at a portion of the adhesive film corresponding to the detecting part so that the hollow part and the detecting part have clearance therebetween;

piling the electronic element and the base member through bumps and the adhesive film in a state where the one surface of the electronic element faces the base member; and

electrically coupling the electronic element and the base member by the bumps, wherein;

a piling of the electronic element and the base member, and a coupling by the bumps are carried out in a state where a first pressure in the hollow part is set to be at atmospheric pressure and a second pressure outside the hollow part is set to be lower than the atmospheric pressure; and

expanding the adhesive film in a direction separating from the detecting part before attaching the adhesive film on the one surface of the electronic element.