Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

• US 7,772,036 B2
• Filed: 04/06/2006
• Issued: 08/10/2010
• Est. Priority Date: 04/06/2006
• Status: Active Grant

• Current Assignee: Chip Packaging Technologies, LLC
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Kolbeck, Anton, Bauer, Robert
• Primary Examiner(s): Smith; Zandra
• Assistant Examiner(s): Novacek; Christy L
• Application Number:
  US11/398,944
• Publication Number:
  US 20070238205A1
• Time in Patent Office: 1,587 Days
• Field of Search: 361/704, 361/709, 361/718, 438/112, 257/675, 257/722, 257/E21.499
• US Class Current: 438/112
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).

Claims

1. A method of manufacturing a semiconductor package by mounting an integrated circuit die on a pad, comprising:

forming at least a first through hole technology (THT) heat spreader structure to protrude through a first surface of the pad;

affixing an integrated circuit die to a second surface of the pad opposite the first surface; and

encasing the integrated circuit die and pad in a compound, leaving exposed the first surface and first THT heat spreader structure.

2. The method of claim 1, where forming at least a first THT heat spreader structure comprises forming a plurality of heat spreader pins integrally to the pad.

3. The method of claim 1, where the first THT heat spreader structure comprises copper.

4. The method of claim 1, further comprising attaching the first THT heat spreader structure to a printed circuit board.

5. The method of claim 4, where attaching a first THT heat spreader structure comprises inserting the THT heat spreader structure through a via formed in the printed circuit board.

6. The method of claim 1, where forming at least a first THT heat spreader structure comprises forming a first heat spreader pin as an integral part of the pad.

7. The method of claim 6, where forming a first heat spreader pin as an integral part of the pad comprises etching, milling, punching or machining a lead frame.

8. The method of claim 1, where forming at least a first THT heat spreader structure comprises:

forming a pad having at least one mounting hole formed in the first surface;

forming at least a first heat spreader pin; and

affixing the first heat spreader pin into said mounting hole of the pad so that the first heat spreader pin protrudes from the pad.

9. The method of claim 8, where affixing the first heat spreader pin into said mounting hole comprises press fitting, cold welding or inserting the first heat spreader pin.