Method for manufacturing devices on a multi-layered substrate utilizing a stiffening backing substrate
First Claim
1. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
- providing a handle substrate, the handle substrate having a first deflection characteristic, the handle substrate having a backside and a face;
determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the handle substrate;
coupling the backing substrate having the desired thickness to the backside of the handle substrate to form a multilayered structure;
providing a donor substrate comprising a cleave region, the thickness of material, and a surface region, the cleave region being within the donor substrate to define the thickness of material, the thickness of material being provided between the cleave region and the surface region;
bonding the surface region of the donor substrate to the face of the handle substrate, while the backing substrate remains attached with the handle substrate to maintain at least the deflection characteristic;
initiating a controlled cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region;
removing the thickness of material from the donor substrate; and
forming one or more devices on a portion of the thickness of material.
1 Assignment
0 Petitions
Accused Products
Abstract
A multilayered substrate structure comprising one or more devices, e.g., optoelectronic, integrated circuit. The structure has a handle substrate, which is characterized by a predetermined thickness and a Young'"'"'s modulus ranging from about 1 Mega Pascal to about 130 Giga Pascal. The structure also has a thickness of substantially crystalline material coupled to the handle substrate. Preferably, the thickness of substantially crystalline material ranges from about 100 microns to about 5 millimeters. The structure has a cleaved surface on the thickness of substantially crystalline material and a surface roughness characterizing the cleaved film of less than 200 Angstroms. At least one or more optoelectronic devices is provided on the thickness of material.
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Citations
50 Claims
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1. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
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providing a handle substrate, the handle substrate having a first deflection characteristic, the handle substrate having a backside and a face; determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the handle substrate; coupling the backing substrate having the desired thickness to the backside of the handle substrate to form a multilayered structure; providing a donor substrate comprising a cleave region, the thickness of material, and a surface region, the cleave region being within the donor substrate to define the thickness of material, the thickness of material being provided between the cleave region and the surface region; bonding the surface region of the donor substrate to the face of the handle substrate, while the backing substrate remains attached with the handle substrate to maintain at least the deflection characteristic; initiating a controlled cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region; removing the thickness of material from the donor substrate; and forming one or more devices on a portion of the thickness of material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
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providing a transparent handle substrate, the transparent handle substrate having a first deflection characteristic, the transparent handle substrate having a backside and a face, the transparent handle substrate having a thickness of between about 10 millimeters and 800 microns and being selected from the group comprising quartz, glass, plastic, a polymer, a ceramic, a composite, or a metal bearing material; determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the transparent handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the transparent handle substrate; coupling the backing substrate having the desired thickness to the backside of the transparent handle substrate to form a multilayered structure; providing a donor substrate comprising a cleave region, the thickness of material, and a surface region, the cleave region being within the donor substrate to define the thickness of material, the thickness of material being provided between the cleave region and the surface region; bonding the surface region of the donor substrate to the face of the transparent handle substrate, while the backing substrate remains attached with the transparent handle substrate to maintain at least the deflection characteristic; initiating a cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region; and removing the thickness of material from the donor substrate. - View Dependent Claims (20, 21)
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22. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
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providing a transparent handle substrate comprising quartz, glass, or a polymer of a thickness of between about 10 millimeters and 800 microns and having a first deflection characteristic, the transparent handle substrate having a backside and a face; determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the transparent handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the transparent handle substrate; coupling the backing substrate having the desired thickness to the backside of the transparent handle substrate to form a multilayered structure; bonding the surface region of the donor substrate to the face of the transparent handle substrate, while the backing substrate remains attached with the transparent handle substrate to maintain at least the deflection characteristic; initiating a controlled cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region; and removing the thickness of material from the donor substrate. - View Dependent Claims (23, 24)
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25. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
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providing a transparent handle substrate comprising quartz, glass, or a polymer of a thickness of between about 10 millimeters and 800 microns and having a first deflection characteristic, the transparent handle substrate having a backside and a face; determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the transparent handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the transparent handle substrate; coupling the backing substrate having the desired thickness to the backside of the transparent handle substrate to form a multilayered structure; providing a donor substrate selected from the group comprising single crystal silicon, SiGe, SiGe alloys, SiC, Group II/VI, and Group III/V compound, the donor substrate comprising a cleave region, the thickness of material, and a surface region, the cleave region being within the donor substrate to define the thickness of material, the thickness of material being provided between the cleave region and the surface region; bonding the surface region of the donor substrate to the face of the transparent handle substrate, while the backing substrate remains attached with the transparent handle substrate to maintain at least the deflection characteristic; initiating a controlled cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region; and removing the thickness of material from the donor substrate. - View Dependent Claims (26, 27, 28, 29, 30)
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31. A method for manufacturing one or more devices on multi-layered substrates, the method comprising:
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providing a transparent handle substrate comprising quartz, glass, or a plastic material of a thickness of between about 10 millimeters and 800 microns and having a first deflection characteristic, the transparent handle substrate having a backside and a face; determining a desired thickness of a backing substrate such that the backing substrate being adequate to cause the first deflection characteristic of the transparent handle substrate to be reduced to a predetermined level, the predetermined level being a suitable deflection characteristic for a thickness of material to be transferred onto the face of the transparent handle substrate; coupling the backing substrate having the desired thickness to the backside of the transparent handle substrate to form a multilayered structure; providing a donor substrate comprising a cleave region, the thickness of material, and a surface region, the cleave region being within the donor substrate to define the thickness of material, the thickness of material being provided between the cleave region and the surface region; bonding the surface region of the donor substrate to the face of the transparent handle substrate, while the backing substrate remains attached with the transparent handle substrate to maintain at least the deflection characteristic; initiating a controlled cleaving process within a portion of the cleave region of the donor substrate to begin removal of the thickness of material from the donor substrate at a portion of the cleave region; removing the thickness of material from the donor substrate; and forming one or more devices on a portion of the thickness of material. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification