Light emitting diode lamp

• US 7,772,597 B2
• Filed: 04/20/2005
• Issued: 08/10/2010
• Est. Priority Date: 05/27/2004
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Inoue, Tomio
• Primary Examiner(s): SEFER, AHMED N
• Application Number:
  US11/597,493
• Publication Number:
  US 20070221934A1
• Time in Patent Office: 1,938 Days
• Field of Search: 257/79, 257 98-100
• US Class Current: 257/79
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

The present invention relates to an LED lamp including a pair of lead terminals 2 and 3, a cup portion 8 formed at an end of one of the lead terminals by denting the end and having a conical inner peripheral surface serving as a light-reflective surface 9, an LED chip 4, a transparent synthetic resin member 6 covering the ends of the paired lead terminals 2 and 3. The LED chip 4 includes an upper surface provided with an n-electrode 4d or a p-electrode 4e and a lower surface provided with a p-electrode 4e or an n-electrode 4d. An n-type semiconductor layer 4a and a p-type semiconductor layer 4b are provided between the n-electrode 4d and the p-electrode 4e and laminated to each other via a light emitting layer 4c interposed therebetween. The side surface of the LED chip 4 except for the n-electrode 4d and the p-electrode 4e is coated with light-transmitting synthetic resin 10 containing powder of a fluorescent material. The LED chip 4 is die-bonded to an inner bottom surface of the cup portion 8 with the n-electrode 4d or the p-electrode 4e oriented downward whereas the p-electrode 4e or the n-electrode 4d oriented upward.

Claims

1. A light emitting diode lamp comprising:

a cup portion including a mounting bottom surface and a reflective side surface that flares from the bottom surface;

an LED chip mounted on the bottom surface of the cup portion and surrounded by the side surface;

a transparent resin member for covering at least the LED chip in the cup portion; and

a light-transmitting resin coating covering the LED within the transparent resin member and containing a fluorescent material;

the LED chip including a first surface provided with a first electrode, and a second surface located opposite to the first surface and provided with a second electrode;

the LED chip also including a lamination of a light emitting layer, an n-type semiconductor layer and a p-type semiconductor layer with the light emitting layer interposed between the n-type semiconductor layer and the p-type semiconductor layer, the lamination being located between the first and second electrodes; and

the n-type semiconductor layer including an inclined side surface that tapers from a position adjacent the second electrode toward the first electrode, the inclined side surface being covered by the light-transmitting resin coating;

wherein the n-type semiconductor layer also includes a vertical side surface extending from the inclined side surface toward the first electrode.

2. The light emitting diode lamp according to claim 1, further including a pair of lead terminals, one of the lead terminals including an end provided with the cup portion.

3. The light emitting diode lamp according to claim 2, wherein the transparent resin member is in a form of a plate and covers the lead terminals, each of the lead terminals including an edge surface exposed at a mounting surface of the transparent resin member, the edge surface of said each lead terminal being flush with the mounting surface of the transparent resin member.

4. The light emitting diode lamp according to claim 2, wherein the bottom surface of the cup portion is in a form of an elongated rectangle, the transparent resin member is in a form of a plate and covers the lead terminals, each of the lead terminals including an edge surface exposed at a mounting surface of the transparent resin member, the edge surface of said each lead terminal being flush with the mounting surface of the transparent resin member.

5. The light emitting diode lamp according to claim 1, further including an insulating substrate that is partially dented to provided the cup portion, and a light reflective electrode film formed on the bottom surface and side surface of the cup portion, the LED chip being mounted on the reflective electrode film at the bottom surface of the cup portion.

6. The light emitting diode lamp according to claim 1, wherein the bottom surface of the cup portion is in a form of an elongated rectangle.

7. The light emitting diode lamp according to claim 1, wherein one of the first and second electrodes is covered by an additional light-transmitting resin coating containing a fluorescent material.

8. A light emitting diode lamp comprising:

a cup portion including a mounting bottom surface and a reflective side surface that flares from the bottom surface;

an LED chip mounted on the bottom surface of the cup portion and surrounded by the side surface;

a transparent resin member for covering at least the LED chip in the cup portion; and

a light-transmitting resin coating covering the LED within the transparent resin member and containing a fluorescent material;

the LED chip including a first surface provided with a first electrode, and a second surface located opposite to the first surface and provided with a second electrode;

the LED chip also including a lamination of a light emitting layer, an n-type semiconductor layer and a p-type semiconductor layer with the light emitting layer interposed between the n-type semiconductor layer and the p-type semiconductor layer, the lamination being located between the first and second electrodes; and

the n-type semiconductor layer including an inclined side surface that tapers from a position adjacent the second electrode toward the first electrode, the inclined side surface being covered by the light-transmitting resin coating;

wherein the n-type semiconductor layer also includes a first vertical side surface extending from the inclined side surface toward the first electrode, and a second vertical side surface extending from the inclined side surface toward the second electrode.