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LED package with structure and materials for high heat dissipation

  • US 7,772,609 B2
  • Filed: 10/26/2005
  • Issued: 08/10/2010
  • Est. Priority Date: 10/29/2004
  • Status: Active Grant
First Claim
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1. A package for an LED and for attachment to a substrate comprising:

  • a top body layer;

    an intermediate body layer bonded to the top body layer;

    a cavity disposed through the top body layer and the intermediate body layer and having a floor for bonding to the LED;

    a thermal conduction layer bonded to the intermediate body layer and having a first shape which includes a corner, a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface and having a thermal conductivity greater than 14 W/m°

    K; and

    a metallization pattern including a central pad, the central pad plated on the bottom surface of the thermal conduction layer and having a second shape which has a continuously curved periphery without a corner, the first shape of the thermal conduction layer which includes a corner different than the second shape of the central pad which has a continuously curved periphery.

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