LED package with structure and materials for high heat dissipation
First Claim
1. A package for an LED and for attachment to a substrate comprising:
- a top body layer;
an intermediate body layer bonded to the top body layer;
a cavity disposed through the top body layer and the intermediate body layer and having a floor for bonding to the LED;
a thermal conduction layer bonded to the intermediate body layer and having a first shape which includes a corner, a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface and having a thermal conductivity greater than 14 W/m°
K; and
a metallization pattern including a central pad, the central pad plated on the bottom surface of the thermal conduction layer and having a second shape which has a continuously curved periphery without a corner, the first shape of the thermal conduction layer which includes a corner different than the second shape of the central pad which has a continuously curved periphery.
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Accused Products
Abstract
LED packages are provided that include a material that is both thermally conductive and has a coefficient of thermal expansion that is matched to that of an LED. The material can be a ceramic such as aluminum nitride. The package has a body that includes a bottom surface and a cavity disposed into the body. The cavity has a floor for bonding to the LED so that the LED sits within the cavity. The thermally conductive material is disposed between the floor of the cavity and the bottom surface of the package. The body can be fabricated from a number of layers where the thermally conductive material is in a layer disposed between the floor and the bottom surface. The other layers of the body can also be fabricated from the thermally conductive material. A light emitting device is made by attaching the LED to the LED package.
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Citations
25 Claims
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1. A package for an LED and for attachment to a substrate comprising:
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a top body layer; an intermediate body layer bonded to the top body layer; a cavity disposed through the top body layer and the intermediate body layer and having a floor for bonding to the LED; a thermal conduction layer bonded to the intermediate body layer and having a first shape which includes a corner, a top surface forming the floor of the cavity and a bottom surface, the thermal conduction layer including a thermally conducting ceramic material disposed between the floor and the bottom surface and having a thermal conductivity greater than 14 W/m°
K; anda metallization pattern including a central pad, the central pad plated on the bottom surface of the thermal conduction layer and having a second shape which has a continuously curved periphery without a corner, the first shape of the thermal conduction layer which includes a corner different than the second shape of the central pad which has a continuously curved periphery. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 13, 23)
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11. A package for an LED comprising:
a body including a top body layer and an intermediate body layer and a cavity disposed in the top body layer and the intermediate body layer and having a floor for bonding to the LED; a thermal conduction layer having a bottom surface and a corner, the thermal conduction layer comprising a thermally conductive material disposed between the floor and the bottom surface, the thermally conductive material having a thermal conductivity greater than 14 W/m°
K and a coefficient of thermal expansion less than 15 ppm/°
C.;a first metallization pattern disposed on a top surface of the thermal conduction layer, the first metallization pattern including a first thermally conductive central pad; and a second metallization pattern plated on the bottom surface of the thermal conduction layer, the second metallization pattern including a second thermally conductive central pad and a separate electrical contact, the second thermally conductive central pad having a periphery without a corner and configured to provide a thermal path from the bottom surface to a substrate. - View Dependent Claims (12, 14, 15, 16, 24)
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17. A light emitting device comprising:
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a body including a cavity disposed in a top body layer and an intermediate body layer and having a floor for bonding to an LED, a bottom surface, and a thermally conducting ceramic material disposed between the floor and the bottom surface and having a thermal conductivity greater than 14 W/m°
K, the thermally conducting ceramic material forming a bottom surface which has rectangular shape;a metallization pattern including a thermally conducting round pad centrally plated to the bottom surface of the body; an LED bonded to the floor of the cavity; and a luminescent material disposed over the LED. - View Dependent Claims (18, 19, 20, 21, 22, 25)
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Specification