Nitride semiconductor device with depressed portion
First Claim
Patent Images
1. A nitride semiconductor device comprising:
- a substrate comprising a nitride semiconductor the substrate further comprising an engraved region and a ridge portion, the engraved region comprising a depression portion; and
a nitride semiconductor layer formed on the substrate so as to be in direct contact with the ridge portion, a bottom surface of the engraved region, and a side surface of the engraved region,wherein when a sectional area of a region surrounded by a sectional portion of the depressed portion cut along a plane perpendicular to a direction in which the depressed portion extends and lines extending from a top surface of the ridge portion parallel to the top surface of the ridge portion is denoted A, anda sectional area occupied by the nitride semiconductor layer laid in the depressed portion is denoted B, then B/A, indicating a degree in which the depressed portion is filled by the nitride semiconductor layer, is 0.8 or less but greater than 0.
1 Assignment
0 Petitions
Accused Products
Abstract
On a processed substrate having an engraved region as a depressed portion formed thereon, a nitride semiconductor thin film is laid. The sectional area occupied by the nitride semiconductor thin film filling the depressed portion is 0.8 times the sectional area of the depressed portion or less.
47 Citations
11 Claims
-
1. A nitride semiconductor device comprising:
-
a substrate comprising a nitride semiconductor the substrate further comprising an engraved region and a ridge portion, the engraved region comprising a depression portion; and a nitride semiconductor layer formed on the substrate so as to be in direct contact with the ridge portion, a bottom surface of the engraved region, and a side surface of the engraved region, wherein when a sectional area of a region surrounded by a sectional portion of the depressed portion cut along a plane perpendicular to a direction in which the depressed portion extends and lines extending from a top surface of the ridge portion parallel to the top surface of the ridge portion is denoted A, and a sectional area occupied by the nitride semiconductor layer laid in the depressed portion is denoted B, then B/A, indicating a degree in which the depressed portion is filled by the nitride semiconductor layer, is 0.8 or less but greater than 0. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
Specification