Image pick-up module and method for assembling such an image pick-up module

• US 7,773,122 B2
• Filed: 11/26/2001
• Issued: 08/10/2010
• Est. Priority Date: 05/27/1999
• Status: Expired due to Fees

• Current Assignee: Karl Storz Se & Co. Kg
• Original Assignee: Karl Storz Se & Co. Kg
• Inventors: Schwarz, Peter, Kehr, Ulrich, Irion, Klaus M., Kocher, Mark
• Primary Examiner(s): Aggarwal; Yogesh K
• Application Number:
  US09/994,178
• Publication Number:
  US 20020080233A1
• Time in Patent Office: 3,179 Days
• Field of Search: 361/749, 348/222.1, 348373-375, 348 45- 65, 348/72, 600/101, 600109-112
• US Class Current: 348/222.1
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

An image pick-up module, especially for an endoscope, comprises an electronic image sensor, a single-piece circuit board which is electrically bonded to the image sensor, with at least one cable leading away from the circuit board being further electrically bonded to the circuit board. The circuit board has at least three sections, with a first section and a second section extending in spaced relation one to the other and obliquely or crosswise to the image sensor and a third section being arranged between the first and the second section. In order to provide for strain relief of the at least one cable, it is proposed that the image sensor be arranged on one side of the circuit board opposite the third section. In a method for assembling the image pick-up module the circuit board initially has the form of a planar board blank comprising at least three sections that can be folded along flexible connecting sections whereby the at least one cable is bonded to the board blank, whereafter the board blank is folded in such a way that a third section is located between a first section and a second section, and finally the image sensor is bonded to the circuit board at an end of the circuit board opposite the third section.

Claims

1. Image pick-up module, comprising:

an endoscope shaft having a longitudinal axis;

an electronic image sensor including an image pick-up surface transverse to the longitudinal axis of said shaft, said image sensor having contact fingers;

a circuit board electrically bonded to said image sensor, said circuit board comprising first and second sections, said first and second sections each having a first end bonded to said image sensor and a second end, wherein said first and second sections extend longitudinally from said image sensor substantially perpendicular to the image pick-up surface of said sensor and substantially in parallel to one other, wherein said contact fingers are electrically bonded to said first section and to said second section; and

a third section having a substantially V-shaped configuration integrally formed with the second end of said second section, said third section having a first leg and a second leg, said first and second legs extending obliquely to said first and section sections;

at least one cable electrically bonded to said circuit board and leading away from said circuit board, wherein said at least one cable being electrically bonded to said first and second legs.

2. The image pick-up module of claim 1, wherein said first leg and said second leg of said V-shaped third section extend along a straight-line prolongation of said first and said second sections, respectively.

3. The image pick-up module of claim 1, wherein said at least one cable is bonded to an outer surface of said circuit board.

4. The image pick-up module of claim 1, wherein said third section comprises at least one passage for said at least one cable leading away from said circuit board.

5. The image pick-up module of claim 1, wherein the interior of said circuit board is filled with an electrically non-conductive feeling compound.

6. The image pick-up module of claim 1, wherein said circuit board comprises a forth section arranged opposite said third section and accommodating said image sensor on its outer surface.

7. The image pick-up module of claim 6, wherein said forth section further comprises at least one of an electric component and at least one electric circuit-board conductor.

8. The image pick-up module of claim 1, wherein said circuit board is provided on its outer surface with recesses for bonding of said image sensor.

9. The image pick-up module of claim 1, wherein said third section of said circuit board further comprises at least one contact for bonding said cable leading away from said circuit board.

10. The image pick-up module of claim 1, wherein said third section of said circuit board further comprises at least one electric circuit-board conductor for electrically connecting said first section and said second section.

11. The image pick-up module of claim 1, wherein said first section and said second section of said board blank are flexibly connected via an additional section, but are arranged in spaced relationship at one and the same level, wherein said first section and said second section each serve for bonding said at least one cable, and wherein said third section is flexibly connected to said additional section on an end face of said additional section.