Flexible substrate, multilayer flexible substrate

• US 7,773,386 B2
• Filed: 10/29/2007
• Issued: 08/10/2010
• Est. Priority Date: 03/19/2004
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Fujii, Toshio, Tomekawa, Satoru, Yabe, Hiroki, Nakatani, Seiichi, Ichiryu, Takashi, Yamashita, Yoshihisa
• Primary Examiner(s): Dinh; Tuan T
• Application Number:
  US11/976,848
• Publication Number:
  US 20080210458A1
• Time in Patent Office: 1,016 Days
• Field of Search: 3613061-3063, 361749-750, 361782-784, 361792-795, 174254-261
• US Class Current: 361/749
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/0191 wherein the thickness of the dielectric plays an important role
• CPC Class Codes: H05K 2201/0376 Flush conductors, i.e. flush with the surface of the printed circuit
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H10K 30/20 comprising organic-organic junctions, e.g. donor-acceptor junctions
• CPC Class Codes: H10K 30/50 Photovoltaic [PV] devices
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

Claims

1. A flexible substrate comprising:

a film;

a first insulating resin layer on a front surface of said film, and a second insulating resin layer on a rear surface of said film, with said front surface and said rear surface facing in opposite directions;

a front-sided wiring pattern embedded in said first insulating resin layer, and a rear-sided wiring pattern embedded in said second insulating resin layer, a surface of said front-sided wiring pattern and a surface of said rear-sided wiring pattern being exposed at an outer surface of the flexible substrate, wherein said exposed surface of said front-sided wiring pattern is flush with a surface of said first insulating resin layer, and said exposed surface of said rear-sided wiring pattern is flush with a surface of said second insulating resin layer;

a via between said front-sided wiring pattern and said rear-sided wiring pattern, said via electrically interconnecting said front-sided wiring pattern and said rear-sided wiring pattern; and

at least one of a passive element and an active element, along with wiring connected thereto, on at least one of said front surface and said rear surface of said film, with said wiring and said via being electrically connected to each other.

2. The flexible substrate according to claim 1, wherein a ratio of a thickness of said first insulating resin layer to a thickness of said film is within a range of from 1.2 to 6, and a ratio of a thickness of said second insulating resin layer to a thickness of said film is within a range of from 1.2 to 6.

3. The flexible substrate according to claim 1, wherein a thickness of said front-sided wiring pattern is 80% to 95% of a thickness of said first insulating resin layer, and a thickness of said rear-sided wiring pattern is 80% to 95% of a thickness of said second insulating resin layer.

4. The flexible substrate according to claim 1, wherein said via comprises a conductive resin composition.

5. The flexible substrate according to claim 1, wherein at least one of said passive element and said active element is film-like.

6. The flexible substrate according to claim 1, wherein

said passive element is selected from the group consisting of a condenser composed of an inorganic dielectric, a resistor, an inductor, and a combination thereof.

7. The flexible substrate according to claim 1, wherein said film comprises one of an aramid film and a polyimide film.

8. The flexible substrate according to claim 1, wherein

resin of at least one of said first and second insulating resin layers comprises at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, an acrylic resin, and a modified form thereof.

9. The flexible substrate according to claim 1, wherein said active element comprises an organic semiconductor.

10. A multilayer flexible substrate comprising:

flexible substrates laminated on one another, with at least one of said flexible substrates comprising the flexible substrate according to claim 1.

11. The flexible substrate according to claim 9, wherein said organic semiconductor comprises a pn junction solar cell.