Capillary condenser/evaporator

• US 7,775,261 B2
• Filed: 03/08/2005
• Issued: 08/17/2010
• Est. Priority Date: 02/26/2002
• Status: Active Grant

• Current Assignee: Mikros Manufacturing, LLC
• Original Assignee: Mikros Manufacturing, Inc.
• Inventors: Valenzuela, Javier A.
• Primary Examiner(s): Duong; Tho V
• Application Number:
  US11/075,467
• Publication Number:
  US 20050230085A1
• Time in Patent Office: 1,988 Days
• Field of Search: 165/80.4, 165/104.21, 165/104.31, 165/104.33, 165/147, 361/699, 361/700
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops

Abstract

A heat transfer device is disclosed for transferring heat to or from a fluid that is undergoing a phase change. The heat transfer device includes a liquid-vapor manifold in fluid communication with a capillary structure thermally connected to a heat transfer interface, all of which are disposed in a housing to contain the vapor. The liquid-vapor manifold transports liquid in a first direction and conducts vapor in a second, opposite direction. The manifold provides a distributed supply of fluid (vapor or liquid) over the surface of the capillary structure. In one embodiment, the manifold has a fractal structure including one or more layers, each layer having one or more conduits for transporting liquid and one or more openings for conducting vapor. Adjacent layers have an increasing number of openings with decreasing area, and an increasing number of conduits with decreasing cross-sectional area, moving in a direction toward the capillary structure.

Claims

1. A heat transfer device for transferring heat to or from a fluid that is undergoing a phase change, the heat transfer device comprising:

a) an inlet adapted to receive a supply of working liquid;

b) a capillary structure spaced from the inlet and adapted to move the fluid by capillary action;

c) a heat transfer interface in thermal communication with the capillary structure;

d) a liquid-vapor manifold constructed and arranged to deliver liquid from the inlet to the capillary structure, the liquid-vapor manifold being further constructed and arranged to direct vapor dispersed by the capillary structure in a direction away from the capillary structure, the liquid-vapor manifold including;

at least a first layer proximal to the capillary structure and at least a second, distal layer, each of the layers including a plurality of conduits, the conduits in adjacent layers being in fluid communication with each other, the conduits of the first, proximal layer being in fluid communication with the capillary structure, each of the conduits being constructed and arranged to transport liquid in a direction from the inlet toward the capillary structure, each of the layers also including one or more openings configured and dimensioned to transport the vapor dispersed by the capillary structure in the direction away from the capillary structure; and

a plurality of discrete liquid delivery sites so as to disperse the liquid over the capillary structure;

e) a housing constructed and arranged to enclose at least the liquid-vapor manifold so as to contain the vapor; and

wherein adjacent layers have an increasing number of conduits when moving in a first direction toward the proximal layer and capillary structure, and wherein a cross-sectional area of each of the conduits decreases between adjacent layers in the first direction toward the proximal layer and capillary structure.

2. The heat transfer device of claim 1, wherein the liquid-vapor manifold has a fractal structure such that adjacent layers further include an increasing number of openings when moving in the first direction toward the proximal layer and capillary structure, and wherein the area of the openings in each layer decreases between adjacent layers in the first direction toward the proximal layer and capillary structure.

3. The heat transfer device of claim 1, wherein each conduit within a layer is formed as a separate member, each conduit having a longitudinal axis, and wherein each conduit within a single layer is disposed such that their longitudinal axis are substantially parallel to the other conduits in that layer.

4. The heat transfer device of claim 3, wherein the first, proximal layer is in contact with the capillary structure such that the longitudinal axis of each conduit in the proximal layer is substantially perpendicular to grooves formed in the capillary structure.

5. The heat transfer device of claim 4, wherein adjacent layers of conduits are orientated with their longitudinal axis substantially perpendicular to the axis of conduits in adjacent layers.

6. The heat transfer device of claim 1, wherein the one or more conduits in each layer are formed as a single, unitary member such that the conduits are interconnected, the single, unitary member further including a plurality of openings disposed therethrough.

7. The heat transfer device of claim 6, wherein adjacent layers have an increasing number of openings when moving in a first direction toward the capillary structure, and wherein a cross-sectional area of the openings decreases between adjacent layers in the first direction toward the capillary structure.

8. The heat transfer device of claim 7, wherein the plurality of openings all have the same geometric shape.

9. The heat transfer device of claim 6, wherein each unitary member has a thickness, the thicknesses increasing with increasing distance of the corresponding ones of the members from the capillary structure.

10. The heat transfer device of claim 2, wherein the liquid-vapor manifold is substantially coextensive with the capillary structure.

11. The heat transfer device of claim 10, in combination with a condenser, the condenser being constructed and arranged to receive the vapor and to condense the vapor to a liquid.

12. The combination of claim 11, wherein the heat transfer device and the condenser form a closed loop system disposed within the housing such that the vapor formed by the heat transfer device is fed to the condenser and becomes liquid, the liquid being brought back to heat transfer device through the liquid vapor interface.

26. The heat transfer device of claim 1, including at least a third layer including one or more conduits, the at least a third layer being disposed between the first layer and the second layer.

13. A heat transfer device for transferring heat to or from a fluid that is undergoing a phase change, the heat transfer device comprising:

a) an outlet adapted to receive a supply of working liquid;

b) a capillary structure spaced from the outlet and adapted to move the fluid by capillary action;

c) a heat transfer interface in thermal communication with the capillary structure;

d) a liquid-vapor manifold including a plurality of discrete liquid collection sites constructed and arranged to collect liquid adjacent the surface of the capillary structure and to transport the liquid in a direction away from the capillary structure toward the outlet, and further constructed and arranged to transport vapor in a direction toward the capillary structure, and wherein the liquid vapor manifold includes at least a first layer proximal to the capillary structure and at least a second, distal layer, each of the layers including one or more conduits, the conduits in adjacent layers being in fluid communication with each other, the conduits of the first, proximal layer being in fluid communication with the capillary structure, each of the conduits being constructed and arranged to transport liquid in the direction away from the capillary structure and toward the outlet, and each of the layers further including one or more openings configured and dimensioned to transport the vapor toward the capillary structure;

e) a housing constructed and arranged to enclose the liquid-vapor manifold so as to contain the vapor; and

wherein adjacent layers have an increasing number of conduits when moving in a first direction toward the proximal layer and capillary structure, and wherein a cross-sectional area of each of the conduits decreases between adjacent layers in the first direction toward the proximal layer and capillary structure.

14. The heat transfer device of claim 13, wherein the liquid-vapor manifold has a fractal structure such that adjacent layers further include an increasing number of openings when moving in the first direction toward the proximal layer and capillary structure, and wherein the area of the openings in each layer decreases between adjacent layers in the first direction toward the proximal layer and capillary structure.

15. The heat transfer device of claim 13, wherein each conduit within a layer is formed as a separate member, each conduit having a longitudinal axis, and wherein each conduit within a single layer is disposed such that their longitudinal axis are substantially parallel to the other conduits in that layer.

16. The heat transfer device of claim 15, wherein the first, proximal layer is in contact with the capillary structure such that the longitudinal axis of each conduit in the proximal layer is substantially perpendicular to grooves formed in the capillary structure.

17. The heat transfer device of claim 16, wherein adjacent layers of conduits are orientated with their longitudinal axis substantially perpendicular to the axis of conduits in adjacent layers.

18. The heat transfer device of claim 13, wherein the one or more conduits in each layer are formed as a single, unitary member such that the conduits are interconnected, the single, unitary member further including a plurality of openings disposed therethrough.

19. The heat transfer device of claim 18, wherein adjacent layers have an increasing number of openings when moving in a first direction toward the capillary structure, and wherein a cross-sectional area of the openings decreases between adjacent layers in the first direction toward the capillary structure.

20. The heat transfer device of claim 19, wherein the plurality of openings all have the same geometric shape.

21. The heat transfer device of claim 18, wherein each unitary member has a thickness, the thicknesses increasing with increasing distance of the corresponding ones of the members from the capillary structure.

22. The heat transfer device of claim 13, wherein the liquid-vapor manifold is substantially coextensive with the capillary structure.

23. The heat transfer device of claim 22, in combination with an evaporator, the evaporator being constructed and arranged to receive the vapor and to condense the vapor to a liquid.

24. The combination of claim 23, wherein the heat transfer device and the evaporator form a closed loop system disposed within the housing such that the liquid formed by the heat transfer device is fed to the evaporator and becomes vapor, the vapor being brought back to heat transfer device through the liquid vapor interface.

27. The heat transfer device of claim 13, including at least a third layer including one or more conduits, the at least a third layer being disposed between the first layer and the second layer.

25. A heat transfer device for transferring heat to or from a fluid that is undergoing a phase change, the heat transfer device comprising:

a) a capillary structure spaced from the port and adapted to move the fluid by capillary action;

b) a heat transfer interface in thermal communication with the capillary structure;

c) a liquid-vapor manifold in fluid communication with the capillary structure, the liquid-vapor manifold having at least a first, proximal layer adjacent the capillary structure and a second, distal layer, each layer including;

(i) one or more conduits constructed and arranged to direct liquid between an external member and the capillary structure, wherein adjacent layers have an increasing number of conduits when traveling in a first direction toward the first surface of the capillary structure, and wherein a cross-sectional area of the conduits decreases in the first direction between layers;

(ii) a plurality of openings configured and dimensioned to direct vapor in a direction opposite the flow of the liquid, wherein adjacent layers have an increasing number of openings in a direction toward the capillary structure, and wherein the cross-sectional area of the openings decreases in the first direction between layers;

d) a port constructed and arranged to deliver liquid between the liquid-vapor manifold device and an external member; and

e) a housing constructed and arranged to enclose the liquid-vapor manifold so as to contain the vapor.

28. The heat transfer device of claim 25, including at least a third layer including one or more conduits, the at least a third layer being disposed between the first layer and the second layer;

c) a liquid-vapor manifold in fluid communication with the capillary structure, the liquid-vapor manifold having at least a first, proximal layer adjacent the capillary structure and a second, distal layer, each layer including;

(i) one or more conduits constructed and arranged to direct liquid between an external member and the capillary structure, wherein adjacent layers have an increasing number of conduits when traveling in a first direction toward the first surface of the capillary structure, and wherein a cross-sectional area of the conduits decreases in the first direction between layers;

(ii) a plurality of openings configured and dimensioned to direct vapor in a direction opposite the flow of the liquid, wherein adjacent layers have an increasing number of openings in a direction toward the capillary structure, and wherein the cross-sectional area of the openings decreases in the first direction between layers;

d) a port constructed and arranged to deliver liquid between the liquid-vapor manifold device and an external member; and

e) a housing constructed and arranged to enclose the liquid-vapor manifold so as to contain the vapor.