Controlled vapor deposition of multilayered coatings adhered by an oxide layer
First Claim
1. A method of depositing a multilayered coating on a substrate, which coating is tailored to provide a particular characteristic behavior, wherein all layers of said multilayered coating are deposited from a vapor phase, wherein said multilayered coating includes at least one oxide-based layer and at least one organic-based layer, wherein the depositing from the vapor phase employs a stagnant source of reactive moieties during the formation of at least one layer, or a portion of at least one layer, of the multilayered coating, and wherein the stagnant source of reactive moieties is charged to a process chamber, without further addition during formation of the at least one layer or the portion of at least one layer.
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Abstract
An improved vapor-phase deposition method and apparatus for the application of multilayered films/coatings on substrates is described. The method is used to deposit multilayered coatings where the thickness of an oxide-based layer in direct contact with a substrate is controlled as a function of the chemical composition of the substrate, whereby a subsequently deposited layer bonds better to the oxide-based layer. The improved method is used to deposit multilayered coatings where an oxide-based layer is deposited directly over a substrate and an organic-based layer is directly deposited over the oxide-based layer. Typically, a series of alternating layers of oxide-based layer and organic-based layer are applied.
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Citations
42 Claims
- 1. A method of depositing a multilayered coating on a substrate, which coating is tailored to provide a particular characteristic behavior, wherein all layers of said multilayered coating are deposited from a vapor phase, wherein said multilayered coating includes at least one oxide-based layer and at least one organic-based layer, wherein the depositing from the vapor phase employs a stagnant source of reactive moieties during the formation of at least one layer, or a portion of at least one layer, of the multilayered coating, and wherein the stagnant source of reactive moieties is charged to a process chamber, without further addition during formation of the at least one layer or the portion of at least one layer.
- 37. A method of controlling the surface roughness of a multilayered organo-silicon-containing coating on a substrate, wherein said multilayered coating is deposited from a vapor phase, wherein at least one layer is formed using an organosilane precursor which is introduced into a coating deposition chamber in which said multilayered coating is deposited, and wherein a surface roughness of at least one layer is further controlled by controlling a total pressure in said deposition chamber, a partial pressure of at least one precursor, and a temperature of a substrate on which said coating is deposited, wherein at least two organosilane precursors are introduced into said coating deposition chamber, followed by the introduction of water, whereby controllable co-deposition of said organosilane precursors is obtained.
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39. A method of depositing a multilayered coating wherein an oxide-based layer thickness in direct contact with a substrate is controlled as a function of the chemical composition of said substrate, and wherein a SAM organic-based layer is deposited directly over said oxide-based layer, whereby an ability of said SAM organic-based layer to bond to said oxide-based layer is improved due to control of said oxide-based layer surface coverage and thickness.
- 40. A method of depositing a multilayered coating over a substrate, comprising deposition of at least two oxide-based layers and at least one organic-based layer, where each layer is deposited from a vapor phase, wherein said oxide based layer and said organic-based layer are alternated, wherein an oxide-based layer is deposited directly over a surface of said substrate, wherein said deposition employs a stagnant source of reactive moieties during the formation of at least one layer, or a portion of at least one layer, of the multilayered coating, and wherein the stagnant source of reactive moieties is charged to a process chamber, without further addition during formation of the at least one layer or the portion of at least one layer.
Specification