Method for pattern formation and apparatus for pattern formation

• US 7,776,402 B2
• Filed: 12/27/2005
• Issued: 08/17/2010
• Est. Priority Date: 12/28/2004
• Status: Expired due to Fees

• Current Assignee: Grapac Japan Co., Inc.
• Original Assignee: Grapac Japan Co., Inc.
• Inventors: Yumoto, Yoshihide
• Primary Examiner(s): Norton; Nadine G
• Assistant Examiner(s): Dahimene; Mahmoud
• Application Number:
  US11/793,969
• Publication Number:
  US 20080095934A1
• Time in Patent Office: 1,694 Days
• Field of Search: 427/162, 427/256, 427/264, 118/110, 118/46, 118/642, 118/669, 257/79, 362/555, 438/502, 264/1.32, 359/647, 425/110, 425/174.4
• US Class Current: 427/402
• CPC Class Codes: B05D 1/02 performed by spraying
• CPC Class Codes: B29C 59/00 Surface shaping of articles, e.g. embossing; Apparatus therefor in-mould printing B29C37/0025; by using liquids B29C71/0009; by using gases without chemical reaction B29C71/009; for decorating in general B44; abrasive blasting B24C; chemical aspects C08J7/00
• CPC Class Codes: B29D 11/00365 Production of microlenses lenticular sheets B29D11/00278
• CPC Class Codes: G02B 27/60 Systems using moiré fringes
• CPC Class Codes: G02B 3/0012 characterised by the manufacturing method
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G02B 30/27 involving lenticular arrays
• CPC Class Codes: G02F 1/133354 Arrangements for aligning or assembling substrates
• CPC Class Codes: H01J 9/242 Spacers between faceplate and backplate
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements

Abstract

The present invention relates to a method for pattern formation and an apparatus for pattern formation, the method comprising: applying, between partition lines for pattern formation formed on a surface of a base member, a resin composition for pattern formation having small compatibility or substantially no compatibility with a resin forming the partition lines for pattern formation, in a state in which the surface of the base member with the partition lines for pattern formation formed whereon is placed face down; maintaining the state in which the resin composition for pattern formation is held on the surface of the base member that is placed face down in order to form the resin composition for pattern formation applied between the partition lines for pattern formation into a downward convex shape; and curing the resin composition for pattern formation that is formed into the downward convex shape in order to form a pattern.

Claims

1. A method for pattern formation comprising:

applying, between partition lines for pattern formation formed on a surface of a base member, a resin composition for pattern formation being repelled by a resin forming the partition lines for pattern formation by printing or coating, in a state in which the surface of the base member with the partition lines for pattern formation formed thereon is placed face down;

maintaining the state in which the resin composition for pattern formation is held on the surface of the base member that is placed face down in order to form the resin composition for pattern formation applied between the partition lines for pattern formation into a downward convex shape; and

curing the resin composition for pattern formation that is formed into the downward convex shape in order to form a pattern.

3. The method for pattern formation according to claim 1 or 2, wherein the pattern is a convex lens.

4. The method for pattern formation according to claim 1, wherein the resin composition for pattern formation has a refractive index of 1.35 to 1.75.

5. The method for pattern formation according to claim 1, wherein the resin composition for pattern formation comprises 50 to 95 wt % of a polymerizable substance, 0 to 5 wt % of a contraction inhibitor and 1 to 15 wt % of a polymerization initiator.

6. The method for pattern formation according to claim 1, wherein the resin forming the partition lines for pattern formation is applied to the surface of the base member by printing.

2. A method for pattern formation comprising:

forming a first undercoating layer on a surface of a base member and then forming a second undercoating layer on a surface of the first undercoating layer, wherein said second undercoating layer has broken parts at predetermined intervals through which parts of the first undercoating layer are exposed;

applying a resin composition for pattern formation that is repelled by the first undercoating layer but is not repelled by the second undercoating layer by printing or coating, in a state in which the surface of the base member having the first undercoating layer and the second undercoating layer is placed face down;

maintaining the state in which the resin composition for pattern formation is held on the faced-down second undercoating layer in order to form the resin composition for pattern formation held on the second undercoating layer into a downward convex shape; and

curing the resin composition for pattern formation that is formed into the downward convex shape in order to form a pattern.