Method of manufacturing light emitting diodes
First Claim
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1. A method of manufacturing a light emitting diode, comprising:
- forming a laser lift-off (LLO) layer comprising at least one of GaN, InGaN, AlGaN and InAlGaN on a nitride semiconductor substrate;
forming a first semiconductor layer on the laser lift-off layer;
forming an active layer and a second semiconductor layer on the first semiconductor layer;
bonding a carrier to a surface of the second semiconductor layer;
carrying out a laser lift-off process in which the laser beam is irradiated on the LLO layer through the nitride semiconductor substrate to separate the nitride semiconductor substrate;
forming a metallic support on of the first semiconductor layer on which the nitride semiconductor substrate is separated;
removing the carrier formed on the surface of the second semiconductor layer;
forming a first electrode on the surface of the second semiconductor layer on which the carrier is removed; and
forming a second electrode on the metallic support,wherein the LLO layer is completely removed by irradiating the laser beam, wherein the carrier comprises any one of a glass substrate, a sapphire substrate, a silicon substrate, a ZnO substrate, and a nitride semiconductor substrate, or a template substrate in which at least one of GaN, InGaN, AlGaN, and AlInGaN is laminated on anyone of a glass substrate, a sapphire substrate, a silicon substrate, a ZnO substrate, and a nitride semiconductor substrate.
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Abstract
A method of manufacturing a light emitting diode, wherein a laser lift-off (LLO) layer and an epi-layer are formed on a nitride semiconductor substrate, and the nitride semiconductor substrate is then separated through a laser lift-off process, thereby improving the characteristics of the epi-layer and enabling to fabricate a high-grade and high-efficiency light emitting diode. Further, the LLO layer thus prepared is removed using a laser beam so that the relatively expensive nitride semiconductor substrate can be re-used, thereby reducing manufacturing costs.
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Citations
17 Claims
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1. A method of manufacturing a light emitting diode, comprising:
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forming a laser lift-off (LLO) layer comprising at least one of GaN, InGaN, AlGaN and InAlGaN on a nitride semiconductor substrate; forming a first semiconductor layer on the laser lift-off layer; forming an active layer and a second semiconductor layer on the first semiconductor layer; bonding a carrier to a surface of the second semiconductor layer; carrying out a laser lift-off process in which the laser beam is irradiated on the LLO layer through the nitride semiconductor substrate to separate the nitride semiconductor substrate; forming a metallic support on of the first semiconductor layer on which the nitride semiconductor substrate is separated; removing the carrier formed on the surface of the second semiconductor layer; forming a first electrode on the surface of the second semiconductor layer on which the carrier is removed; and forming a second electrode on the metallic support, wherein the LLO layer is completely removed by irradiating the laser beam, wherein the carrier comprises any one of a glass substrate, a sapphire substrate, a silicon substrate, a ZnO substrate, and a nitride semiconductor substrate, or a template substrate in which at least one of GaN, InGaN, AlGaN, and AlInGaN is laminated on anyone of a glass substrate, a sapphire substrate, a silicon substrate, a ZnO substrate, and a nitride semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification