Copolymers, polymer resin composition for buffer layer method of forming a pattern using the same and method of manufacturing a capacitor using the same
First Claim
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1. A method of forming a capacitor comprising:
- forming an insulating layer on a semiconductor substrate;
forming an opening in the insulating layer;
forming a conductive layer on an upper surface of the insulating layer and a lower surface and sidewalls of the opening;
forming a buffer layer on the conductive layer, the buffer layer filling the opening and including a major portion of a copolymer having from 61 to 75 weight percent benzyl methacrylate;
from 8 to 15 weight percent alkyl acrylic acid; and
with a remainder being hydroxy alkyl methacrylate;
removing an upper portion of the buffer layer using a developer solution to expose an upper portion of the conductive layer, a lower portion of the buffer layer substantially filling the opening;
removing the upper portion of the conductive layer to separate lower electrode structures;
removing the lower portion of the buffer layer;
forming a dielectric layer on the lower electrode structures; and
forming an upper electrode on the dielectric layer.
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Abstract
The invention is directed to particular polymer compositions that may be generally characterized by the formula:
wherein the variables L, M and N represent the relative molar fractions of the monomers and satisfy the expressions 0<L≦0.8; 0<M≦0.2; 0<L≦0.35; and L+M+N=1; and, wherein R1, R2 and R3 are independently selected from C1-C6 alkyls and derivatives thereof. The invention is also directed to polymer compositions that, when used to form a buffer layer or pattern, can be more easily removed from the surface of a semiconductor substrate, thereby increasing productivity and/or reducing the likelihood of defects and failures associated with residual photoresist material.
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Citations
14 Claims
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1. A method of forming a capacitor comprising:
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forming an insulating layer on a semiconductor substrate; forming an opening in the insulating layer; forming a conductive layer on an upper surface of the insulating layer and a lower surface and sidewalls of the opening; forming a buffer layer on the conductive layer, the buffer layer filling the opening and including a major portion of a copolymer having from 61 to 75 weight percent benzyl methacrylate;
from 8 to 15 weight percent alkyl acrylic acid; and
with a remainder being hydroxy alkyl methacrylate;removing an upper portion of the buffer layer using a developer solution to expose an upper portion of the conductive layer, a lower portion of the buffer layer substantially filling the opening; removing the upper portion of the conductive layer to separate lower electrode structures; removing the lower portion of the buffer layer; forming a dielectric layer on the lower electrode structures; and forming an upper electrode on the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a semiconductor device comprising:
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forming an electric element on a semiconductor substrate; forming an insulating layer on the electric element; forming an opening in the insulating layer to expose a contact region on the electric element; forming a conductive layer on an upper surface of the insulating layer and a lower surface and sidewalls of the opening; forming a buffer layer on the conductive layer, the buffer layer filling the opening and including a major portion of a copolymer having from 61 to 75 weight percent benzyl methacrylate;
from 8 to 15 weight percent alkyl acrylic acid; and
with a remainder being hydroxy alkyl methacrylate;removing an upper portion of the buffer layer using a developer solution to expose an upper portion of the conductive layer, a lower portion of the buffer layer substantially filling the opening; removing the upper portion of the conductive layer to separate lower electrode structures; removing the lower portion of the buffer layer and the insulating layer; forming a dielectric layer on the lower electrode structures; and forming an upper electrode on the dielectric layer. - View Dependent Claims (12, 13, 14)
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Specification