×

Method for fabricating a thick copper line and copper inductor resulting therefrom

  • US 7,776,705 B2
  • Filed: 09/06/2006
  • Issued: 08/17/2010
  • Est. Priority Date: 09/06/2006
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming one or more inductors on a substrate, the method comprising:

  • forming a plurality of integrated circuits on the substrate;

    forming a metal layer over the plurality of integrated circuits;

    forming a passivation layer over the metal layer and the plurality of integrated circuits;

    forming a plurality of openings in the passivation layer thereby exposing a portion of the metal layer;

    forming a copper barrier layer over the passivation layer and the plurality of passivation layer openings;

    forming a photoresist layer over the copper barrier layer;

    anisotropically etching the photoresist layer to form at least one trench;

    substantially filling the at least one trench with a copper material to form a copper layer having at least one inductor portion, each inductor portion having an uppermost portion;

    removing the photoresist layer;

    annealing the copper layer;

    forming a dielectric material over the copper layer;

    removing horizontal sections of the dielectric material including the dielectric material from the uppermost portion of each inductor portion of the copper layer thus leaving a vertical portion of the dielectric material on sidewalk of each inductor portion; and

    etching through portions of the copper barrier layer contained within the plurality of passivation layer openings to expose the metal layer.

View all claims
  • 17 Assignments
Timeline View
Assignment View
    ×
    ×