Methods of operating electronic devices, and methods of providing electronic devices
First Claim
1. A cellular phone housing comprising:
- a first die mounted on a substrate, the first die having first transmit and receive circuitry configured to transmit and receive radio frequency signals via a first antenna; and
a second die mounted on the substrate, the second die discrete from the first die and having second transmit and receive circuitry configured to transmit and receive radio frequency signals via a second antenna;
wherein the first die, the second die, and the substrate are all contained within the cellular phone housing, at least one of the first die and the second die void of electrical interconnects that carry communication signals between each other;
wherein the first transmit and receive circuitry and the second transmit and receive circuitry are configured to establish a wireless communications link between the first and second die, and wherein there is no communication between the first and second die other than via a wireless communications link; and
wherein electronic connections between the first and second die and the substrate are power connections only.
2 Assignments
0 Petitions
Accused Products
Abstract
Some embodiments include a method disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing.
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Citations
34 Claims
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1. A cellular phone housing comprising:
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a first die mounted on a substrate, the first die having first transmit and receive circuitry configured to transmit and receive radio frequency signals via a first antenna; and a second die mounted on the substrate, the second die discrete from the first die and having second transmit and receive circuitry configured to transmit and receive radio frequency signals via a second antenna; wherein the first die, the second die, and the substrate are all contained within the cellular phone housing, at least one of the first die and the second die void of electrical interconnects that carry communication signals between each other; wherein the first transmit and receive circuitry and the second transmit and receive circuitry are configured to establish a wireless communications link between the first and second die, and wherein there is no communication between the first and second die other than via a wireless communications link; and wherein electronic connections between the first and second die and the substrate are power connections only. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A microelectronic device, comprising:
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a cellular phone housing; and a plurality of die mounted on a substrate within the cellular phone housing, each of the plurality of die having a processor and transceiver circuitry coupled to the processor, wherein an antenna is coupled to the transceiver circuitry; physical connections to each of the plurality of die, wherein the physical connections provide only power connections to the die; wherein the transceiver circuitry on each of the die is configured to establish wireless communications links among individual ones of the die, and wherein there is no communication among the plurality of die other than via the wireless communications links. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of operating a microelectronic device, the method comprising:
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establishing a wireless communications link between an integrated circuit transmitter on a first die and an integrated circuit receiver on a second die, wherein the first and second die are mounted within a cellular phone housing, wherein electronic connections between the first and second die and the substrate are power connections only; transmitting operating instructions by the integrated circuit transmitter on the first die; and receiving the operating instructions at the integrated circuit receiver on the second die to operate additional integrated circuitry on the second die. - View Dependent Claims (17, 18, 19, 20, 21)
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22. An apparatus, comprising:
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first integrated circuitry mounted on a substrate within a cellular phone housing, the first integrated circuitry comprising first transmit circuitry configured to transmit radio frequency signals via a first antenna; second integrated circuitry mounted on the substrate within the cellular phone housing, the second integrated circuitry comprising second receive circuitry configured to receive radio frequency signals via a second antenna; wherein the first transmit circuitry and the second receive circuitry are configured to establish a wireless communications link between the first and second integrated circuitry, and wherein there is no communication from the first integrated circuitry to the second integrated other than via a wireless communications link; wherein electronic connections between the first and second die and the substrate are power connections only. - View Dependent Claims (23, 24, 25)
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26. A method comprising:
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establishing a wireless communications link between an integrated circuit transmitter on a first die and an integrated circuit receiver on a second die, wherein the first and second die are mounted within a microelectronic package, wherein electro-physical connections between the first die and the second die are power connections only; transmitting signals by the integrated circuit transmitter on the first die; and receiving the signals at the integrated circuit receiver on the second die. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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Specification