Wireless sensor for semiconductor processing systems
First Claim
Patent Images
1. A wireless substrate-like sensor comprising:
- a power source adapted to provide power to the sensor;
a wireless communication module coupled to the power source;
a controller coupled to the power source and the wireless communication module; and
an acceleration detection component operably coupled to the controller to provide acceleration information relative to acceleration of the sensor in three axes, wherein the acceleration detection component is configured to provide acceleration information with respect to three directions corresponding to the three axes, the three directions being orthogonal to each other.
2 Assignments
0 Petitions
Accused Products
Abstract
A wireless sensor is provided to obtain information relating to vibration of wafers or substrates in a semiconductor processing system. In one exemplary embodiment, a wireless substrate-like sensor is provided and includes a power source adapted to provide power to the sensor, a wireless communication module coupled to the power source, and a controller coupled to the power source and the wireless communication module. An acceleration detection component is operably coupled to the controller to provide information relative to acceleration of the sensor in three axes.
116 Citations
18 Claims
-
1. A wireless substrate-like sensor comprising:
-
a power source adapted to provide power to the sensor; a wireless communication module coupled to the power source; a controller coupled to the power source and the wireless communication module; and an acceleration detection component operably coupled to the controller to provide acceleration information relative to acceleration of the sensor in three axes, wherein the acceleration detection component is configured to provide acceleration information with respect to three directions corresponding to the three axes, the three directions being orthogonal to each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A carrier configured to carry a plurality of substrates, the carrier comprising:
-
a plurality of slots, each slot being configured to carry a respective substrate; and a sensor disposed within the carrier to transduce acceleration to which the carrier is subjected, the sensor having a wireless communication module for providing information relative to the acceleration, wherein the sensor comprises; a power source adapted to provide power to the sensor; a controller coupled to the power source and wireless communication module; and one or more accelerometers configured to provide acceleration information to the controller relative to acceleration of the sensor in three axes wherein the one or more accelerometers are configured to provide acceleration information with respect to three directions that correspond to the three axes, wherein the three directions are substantially orthogonal to each other. - View Dependent Claims (12, 13)
-
-
14. A method for obtaining information indicative of vibration with a sensor within a semiconductor processing environment, the method comprising:
-
a) providing at least one accelerometer associated with the sensor and configured to obtain information relating to acceleration of the sensor; b) utilizing the at least one accelerometer to obtain acceleration information relating to acceleration of the sensor relative to three axes that are substantially orthogonal; c) processing the acceleration information within the sensor; and d) transmitting the acceleration information with the sensor to a device that is remote from the sensor, wherein steps (b) and (d) occur in substantially real-time. - View Dependent Claims (15, 16, 17, 18)
-
Specification