Substrate supporting/transferring tray

• US 7,780,440 B2
• Filed: 10/18/2005
• Issued: 08/24/2010
• Est. Priority Date: 10/19/2004
• Status: Active Grant

• Current Assignee: Canon Anelva Corporation (Canon Inc.)
• Original Assignee: Canon Anelva Corporation (Canon Inc.)
• Inventors: Shibagaki, Masami, Kurematsu, Yasumi
• Primary Examiner(s): Wilson; Gregory A
• Application Number:
  US11/665,446
• Publication Number:
  US 20080128969A1
• Time in Patent Office: 1,771 Days
• Field of Search: 432/247, 432/249, 432/251, 432/253, 432/258, 432/254.2, 432/261, 414/935, 414/937, 414/939, 219/443.1, 219/451.1, 211/41.18
• US Class Current: 432/247
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67346 characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/68714 the wafers being placed on a susceptor, stage or support
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile

Abstract

To provide a substrate supporting/transferring tray, which can be placed on a substrate supporting part arranged in a treatment chamber in which the heat treatment is performed to a substrate, especially on a substrate supporting part having a built-in heating means for heating the substrate, and on an upper side of which, the substrate is placed. At the time of heat-treating the substrate, the substrate can be more uniformly heated, and when the heat treatment is completed, the tray can be easily removed from the substrate supporting part without waiting for the temperature of the substrate to be reduced, and can transfer the substrate to other parts from the treatment chamber in which the heat treatment is performed. The substrate supporting/transferring tray, which has the disc-shaped substrate supporting part on an upper plane side, and is provided with a cylindrical side wall part extending from a periphery of the disc-shaped substrate supporting part to a lower side, and an annular part extending from a lower end side of the cylindrical side wall part to an outer side in a diameter direction.

Claims

1. A substrate supporting/transferring tray on which a semiconductor substrate may be placed and which tray is adapted to be placed on a substrate supporting member arranged in a treatment chamber in which the heat treatment occurs for the substrate, the substrate supporting/transferring tray comprising:

a substrate supporting portion formed in a disc-shape on an upper side of the substrate supporting/transferring tray;

a lateral wall portion extending downwardly from a peripheral edge of the disc-shape substrate supporting portion; and

a cap disposed on the substrate supporting portion for sealing the space in which the substrate may be placed on the upper side of the substrate supporting portion, said cap having a hooking step on its bottom end side for engaging an outer periphery on an upper end of the substrate supporting portion and having an inner diameter of its lateral wall located on the hooking step being larger than an outer diameter on the upper end of the substrate supporting portion by at least a positive tolerance.

2. The substrate supporting/transferring tray as defined by claim 1, wherein the lateral wall portion is substantially cylindrical.

3. The substrate supporting/transferring tray as defined by claim 2, further comprising an annular portion extending radially outwardly from a bottom end of the lateral wall portion.

4. The substrate supporting/transferring tray as defined by claim 1, wherein the lateral wall portion is diametrically enlarged as it extends vertically from the peripheral edge of the disc-shape substrate supporting portion.

5. The substrate supporting/transferring tray as defined by claim 4, further comprising an annular portion extending radially outwardly from a bottom end of the lateral wall portion.

6. The substrate supporting/transferring tray as defined by claim 5, wherein the lateral wall portion extends downwardly from an entirety of the peripheral edge of the disc-shape substrate supporting portion.

7. The substrate supporting/transferring tray as defined by claim 4, wherein the lateral wall portion extends downwardly from an entirety of the peripheral edge of the disc-shape substrate supporting portion.

8. The substrate supporting/transferring tray as defined by claim 1, further comprising an annular portion extending radially outwardly from a bottom end of the lateral wall portion.

9. The substrate supporting/transferring tray as defined by claim 8, wherein the lateral wall portion extends downwardly from an entirety of the peripheral edge of the disc-shape substrate supporting portion.

10. The substrate supporting/transferring tray as defined by claim 1, wherein the lateral wall portion extends downwardly from an entirety of the peripheral edge of the disc-shape substrate supporting portion.