Optoelectronic component comprising an encapsulant

• US 7,781,727 B2
• Filed: 03/25/2008
• Issued: 08/24/2010
• Est. Priority Date: 11/25/1998
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Nuvotronics LLC
• Inventors: Heiks, Noel A., Sherrer, David W.
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US12/079,248
• Publication Number:
  US 20080277571A1
• Time in Patent Office: 882 Days
• Field of Search: 250/239, 250/214.1, 250/216, 250/208.1, 257 80- 85, 257433-436, 385 7- 12
• US Class Current: 250/239
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4231 with intermediate elements, e.g. rods and balls, between the elements
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Abstract

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.

Claims

1. An optoelectronic component, comprising:

a substrate;

an optoelectronic device on the substrate; and

an encapsulant over the optoelectronic device and discontinuous over the substrate,

wherein the encapsulant has a molded face which comprises an optical element formed from the encapsulant.

2. The optoelectronic component of claim 1, comprising a plurality of the optoelectronic devices and a plurality of the optical elements.

3. The optoelectronic component of claim 2, wherein the optical elements are lenses.

4. The optoelectronic component of claim 1, wherein the optical element is a lens.

5. The optoelectronic component of claim 4, wherein the lens comprises a rounded protrusion.

6. The optoelectronic component of claim 1, wherein the optical element is a mirror for reflecting light to or from the optoelectronic device.

7. The optoelectronic component of claim 6, wherein the mirror comprises an angular surface of the encapsulant off which light reflects.

8. The optoelectronic component of claim 1, wherein the substrate comprises a trench in which the optoelectronic device is disposed.

9. The optoelectronic component of claim 1, wherein the substrate is formed from silicon.

10. The optoelectronic component of claim 1, wherein the encapsulant is discontinuous over at least a portion of the substrate opposite the substrate over which the optoelectronic device is on.