Optical device

• US 7,781,855 B2
• Filed: 04/18/2008
• Issued: 08/24/2010
• Est. Priority Date: 04/19/2007
• Status: Expired due to Fees

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Shoji, Iwao
• Primary Examiner(s): Dang; Phuc T
• Application Number:
  US12/148,372
• Publication Number:
  US 20080290439A1
• Time in Patent Office: 858 Days
• Field of Search: 257/432, 257/434, 257/680, 257/686, 257/E31.117, 257/E31.127
• US Class Current: 257/434
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optical device includes a metal film that has a first plane and a second plane electrically connected to the first plane. For example, the second plane is integrally formed with the first plane. The second plane is arranged at an obtuse angle θ (90°<θ<180°) with respect to the first plane. An optical semiconductor chip is mounted on the second plane of the metal film, and a light-transmitting sealing material seals the optical semiconductor chip. The light-transmitting sealing material has the metal film provided on a surface thereof.

Claims

1. An optical device comprising:

a metal film including a first plane and a second plane electrically connected to the first plane, the second plane being arranged at an obtuse angle θ

, where 90°

<

θ

<

180°

, with respect to the first plane, wherein the second plane of the metal film includes a positive electrode pattern and a negative electrode pattern, and the first plane of the metal film includes a positive electrode pattern and a negative electrode pattern continuous with the positive electrode pattern and negative electrode pattern of the second plane;

an optical semiconductor chip having a positive electrode and a negative electrode on a same surface thereof and an optical axis, wherein the optical semiconductor chip is flip-chip mounted on the positive electrode pattern and the negative electrode pattern of the metal film only on the second plane; and

a light-transmitting sealing material for sealing the optical semiconductor chip, the light-transmitting sealing material having the metal film provided on a surface thereof, and the light transmitting sealing material conforming to the first plane and the second plane of the metal film,

wherein the first plane is mounted on a surface of a mounting board, so that the optical axis of the optical semiconductor chip is inclined with respect to the surface of the mounting board.

2. The optical device according to claim 1, wherein the metal film includes side portions on both sides of the first plane and the second plane, the side portions being electrically connected to the first plane and the second plane.

3. The optical device according to claim 2, wherein each of the side portions has a notch.

4. The optical device according to claim 1, wherein the sealing material has a lens shape such that the sealing material functions as a lens with respect to the optical semiconductor chip.

5. The optical device according to claim 2, wherein the sealing material has a lens shape such that the sealing material functions as a lens with respect to the optical semiconductor chip.

6. The optical device according to claim 3, wherein the sealing material has a lens shape for functioning as a lens with respect to the optical semiconductor chip.

7. The optical device according to claim 1, wherein the optical semiconductor chip comprises a light emitting element, and the optical device functions as a projector.

8. The optical device according to claim 2, wherein the optical semiconductor chip comprises a light emitting element, and the optical device functions as a projector.

9. The optical device according to claim 3, wherein the optical semiconductor chip comprises a light emitting element, and the optical device functions as a projector.

10. The optical device according to claim 4, wherein the optical semiconductor chip comprises a light emitting element, and the optical device functions as a projector.

11. The optical device according to claim 7, wherein the sealing material contains a wavelength converting material.

12. The optical device according to claim 8, wherein the sealing material contains a wavelength converting material.

13. The optical device according to claim 9, wherein the sealing material contains a wavelength converting material.

14. The optical device according to claim 10, wherein the sealing material contains a wavelength converting material.

15. The optical device according to claim 1, wherein the optical semiconductor chip comprises a light receiving element, and the optical device functions as a photoreceptor.

16. The optical device according to claim 2, wherein the optical semiconductor chip comprises a light receiving element, and the optical device functions as a photoreceptor.

17. The optical device according to claim 3, wherein the optical semiconductor chip comprises a light receiving element, and the optical device functions as a photoreceptor.

18. The optical device according to claim 4, wherein the optical semiconductor chip comprises a light receiving element, and the optical device functions as a photoreceptor.

19. The optical device according to claim 1, wherein the light-transmitting sealing material has a parallelogram cross-section formed by the first plane, the second plane, a third plane parallel to the first plane farther from the metal layer of the second plane, and a fourth plane parallel to the second plane adjacent to the first plane, the parallelogram cross-section being taken along a plane perpendicular both to the first plane and the second plane.

20. The optical device according to claim 2, wherein the side portions have a polygonal shape formed on respective side planes of the light-transmitting sealing material, and wherein one of the side portions is continuous with the positive electrode pattern and negative electrode pattern of one of the first and second planes of the metal film, and the other of the side portions is continuous with the positive electrode pattern and negative electrode pattern of the other of the first and second planes of the metal film.