Optical device
First Claim
Patent Images
1. An optical device comprising:
- a metal film including a first plane and a second plane electrically connected to the first plane, the second plane being arranged at an obtuse angle θ
, where 90°
<
θ
<
180°
, with respect to the first plane, wherein the second plane of the metal film includes a positive electrode pattern and a negative electrode pattern, and the first plane of the metal film includes a positive electrode pattern and a negative electrode pattern continuous with the positive electrode pattern and negative electrode pattern of the second plane;
an optical semiconductor chip having a positive electrode and a negative electrode on a same surface thereof and an optical axis, wherein the optical semiconductor chip is flip-chip mounted on the positive electrode pattern and the negative electrode pattern of the metal film only on the second plane; and
a light-transmitting sealing material for sealing the optical semiconductor chip, the light-transmitting sealing material having the metal film provided on a surface thereof, and the light transmitting sealing material conforming to the first plane and the second plane of the metal film,wherein the first plane is mounted on a surface of a mounting board, so that the optical axis of the optical semiconductor chip is inclined with respect to the surface of the mounting board.
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Accused Products
Abstract
An optical device includes a metal film that has a first plane and a second plane electrically connected to the first plane. For example, the second plane is integrally formed with the first plane. The second plane is arranged at an obtuse angle θ (90°<θ<180°) with respect to the first plane. An optical semiconductor chip is mounted on the second plane of the metal film, and a light-transmitting sealing material seals the optical semiconductor chip. The light-transmitting sealing material has the metal film provided on a surface thereof.
9 Citations
20 Claims
-
1. An optical device comprising:
-
a metal film including a first plane and a second plane electrically connected to the first plane, the second plane being arranged at an obtuse angle θ
, where 90°
<
θ
<
180°
, with respect to the first plane, wherein the second plane of the metal film includes a positive electrode pattern and a negative electrode pattern, and the first plane of the metal film includes a positive electrode pattern and a negative electrode pattern continuous with the positive electrode pattern and negative electrode pattern of the second plane;an optical semiconductor chip having a positive electrode and a negative electrode on a same surface thereof and an optical axis, wherein the optical semiconductor chip is flip-chip mounted on the positive electrode pattern and the negative electrode pattern of the metal film only on the second plane; and a light-transmitting sealing material for sealing the optical semiconductor chip, the light-transmitting sealing material having the metal film provided on a surface thereof, and the light transmitting sealing material conforming to the first plane and the second plane of the metal film, wherein the first plane is mounted on a surface of a mounting board, so that the optical axis of the optical semiconductor chip is inclined with respect to the surface of the mounting board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification