Exposure apparatus, exposure method, projection optical system and device producing method

• US 7,782,442 B2
• Filed: 12/05/2006
• Issued: 08/24/2010
• Est. Priority Date: 12/06/2005
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Nagasaka, Hiroyuki
• Primary Examiner(s): Glick; Edward J
• Assistant Examiner(s): KREUTZER, COLIN WRIGHT
• Application Number:
  US11/633,508
• Publication Number:
  US 20070153247A1
• Time in Patent Office: 1,358 Days
• Field of Search: 355/30, 355/53, 355/40, 355/46, 355/67, 355/55, 355/77, 356/252, 356399-401, 359/373, 250/491.1, 250/492.2, 250/548, 378/34
• US Class Current: 355/67
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70466 Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature stitching G03F7/70475

Abstract

An exposure apparatus includes an optical unit which defines a first exposure area and a second exposure area at different positions in a first direction and which radiates exposure light beams onto the first and second exposure areas respectively; and a first movement system which moves the first exposure area and the second exposure area relative to a substrate in the first direction. The exposure light beams are radiated by the optical unit onto the first and second exposure areas respectively while moving the first and second exposure areas relative to a predetermined area on the substrate. Accordingly, the predetermined area on the substrate is subjected to multiple exposure with an image of a first pattern formed by the exposure light beam radiated onto the first exposure area and an image of a second pattern formed by the exposure light beam radiated onto the second exposure area. The deterioration of the throughput can be suppressed, and the substrate can be subjected to the multiple exposure efficiently.

Claims

1. An exposure apparatus which exposes a substrate, comprising:

an optical unit which radiates a first exposure light beam from a first area disposed on a first predetermined surface onto a first exposure area and which radiates a second exposure light beam from a second area disposed on a second predetermined surface onto a second exposure area; and

a detecting system having a light-receiving unit which receives a detecting light beam via the first predetermined surface and the second predetermined surface and which obtains information about a positional relationship between a first pattern arranged in the first area and a second pattern arranged in the second area based on a light-receiving result of the light-receiving unit,

wherein the detecting light beam has an optical path that includes the first predetermined surface, the second predetermined surface and the light-receiving unit in this order;

the light-receiving unit receives, as the detecting light beam, at least one of a light beam from a third area which is disposed on the first predetermined surface and which is different from the first area and a light beam from a fourth area which is disposed on the second predetermined surface and which is different from the second area;

the optical unit has a first optical system into which the first exposure light beam from the first area comes and a second optical system which is different from the first optical system and into which the second exposure light beam from the second area comes;

the first optical system is capable of supplying the light beam from the third area to the second optical system;

the second optical system is capable of supplying the light beam from the fourth area to the first optical system; and

the light-receiving unit receives, as the detecting light beam, at least one of the light beam from the third area and the light beam from the fourth area via the first optical system and the second optical system.

2. The exposure apparatus according to claim 1, wherein the light-receiving unit receives the detecting light beam via at least a part of the optical unit.

3. The exposure apparatus according to claim 1, wherein the optical unit has an intermediate optical member which is arranged in the vicinity of positions optically conjugate with the first exposure area and the second exposure area, respectively, to which the first exposure light beam from the first area and the second exposure light beam from the second area come, and which guides the first exposure light beam from the first area and the second exposure light beam from the second area to the first exposure area and the second exposure area respectively.

4. The exposure apparatus according to claim 3, wherein the intermediate optical member has a first reflecting surface which reflects the first exposure light beam coming from the first area and a second reflecting surface which reflects the second exposure light beam coming from the second area.

5. The exposure apparatus according to claim 3, wherein:

the optical unit has a single optical element to which the substrate is arranged to be opposite;

the intermediate optical member guides the first exposure light beam from the first area and the second exposure light beam from the second area to the single optical element; and

the first exposure light beam and the second exposure light beam are radiated onto the first exposure area and the second exposure area respectively via the single optical element.

6. The exposure apparatus according to claim 3, wherein the light-receiving unit receives the detecting light beam not via the intermediate optical member.

7. The exposure apparatus according to claim 1, wherein the light-receiving unit receives, as the detecting light beam, a light beam from at least one of a first mark which is arranged in a predetermined positional relationship with respect to the first pattern and a second mark which is arranged in a predetermined positional relationship with respect to the second pattern.

8. The exposure apparatus according to claim 1, wherein the detecting system includes a radiation unit which radiates the detecting light beam onto at least one of the third area and the fourth area.

9. The exposure apparatus according to claim 8, wherein the detecting light beam has a wavelength which is different from that of the first and second exposure light beams.

10. The exposure apparatus according to claim 8, wherein the detecting light beam has a wavelength same as that of the first and second exposure light beams.

11. The exposure apparatus according to claim 1, wherein a part of at least one of the first exposure light beam and the second exposure light beam is radiated, as the detecting light beam, onto at least one of the third area and the fourth area.

12. The exposure apparatus according to claim 1, wherein the first exposure light beam and the second exposure light beam are radiated onto the first exposure area and the second exposure area respectively while adjusting the positional relationship between the first pattern and the second pattern based on the information obtained by the detecting system.

13. The exposure apparatus according to claim 1, wherein:

the optical unit is capable of forming an image of the first pattern in the first exposure area by radiating the first exposure light beam onto the first exposure area, and the optical unit is capable of forming an image of the second pattern in the second exposure area by radiating the second exposure light beam onto the second exposure area; and

a predetermined area on the substrate is subjected to multiple exposure with the image of the first pattern formed in the first exposure area and the image of the second pattern formed in the second exposure area.

14. A method for producing a device, comprising using the exposure apparatus as defined in claim 1.

25. The exposure apparatus according to claim 1, wherein the detecting light beam has one optical path to the light-receiving unit.

15. An exposure method for exposing a substrate, the exposure method comprising:

radiating with an optical unit a first exposure light beam from a first area disposed on a first predetermined surface onto a first exposure area and radiating with the optical unit a second exposure light beam from a second area disposed on a second predetermined surface onto a second exposure area;

detecting a light beam via the first predetermined surface and the second predetermined surface, the light beam having an optical path that includes the first predetermined surface and the second predetermined surface in this order; and

obtaining information about a positional relationship between a first pattern arranged in the first area and a second pattern arranged in the second area based on a detection result; and

receiving with a light-receiving unit, as the detecting light beam, at least one of a light beam from a third area which is disposed on the first predetermined surface and which is different from the first area and a light beam from a fourth area which is disposed on the second predetermined surface and which is different from the second area,

wherein the optical unit has a first optical system into which the first exposure light beam from the first area comes and a second optical system which is different from the first optical system and into which the second exposure light beam from the second area comes,

the first optical system is capable of supplying the light beam from the third area to the second optical system,

the second optical system is capable of supplying the light beam from the fourth area to the first optical system, and

the light-receiving unit receives, as the detecting light beam, at least one of the light beam from the third area and the light beam from the fourth area via the first optical system and the second optical system.

16. The exposure method according to claim 15, further comprising adjusting the positional relationship between the first pattern and the second pattern based on the information about the positional relationship.

17. The exposure method according to claim 16, wherein the positional relationship between the first and second patterns is adjusted at least during the radiation of the first and second exposure light beams.

18. The exposure method according to claim 16, wherein the positional relationship between the first and second patterns is adjusted at least before the substrate is exposed with the first and second exposure light beams.

19. The exposure method according to claim 15, wherein the information about the positional relationship between the first pattern and the second pattern is obtained by detecting marks arranged on the first predetermined surface and the second predetermined surface.

20. The exposure method according to claim 19, wherein the marks are arranged outside the first area and the second area.

21. The exposure method according to claim 15, wherein the light beam via the first predetermined surface and the second predetermined surface has a wavelength which is different from that of the first and second exposure light beams.

22. The exposure method according to claim 15, wherein the light beam via the first predetermined surface and the second predetermined surface has a wavelength same as that of the first and second exposure light beams.

23. The exposure method according to claim 15, wherein the substrate is subjected to multiple exposure with images of the first and second patterns formed in the first and second exposure areas by being irradiated with the first and second exposure light beams.

24. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure method as defined in claim 15;

developing the substrate subjected for which the multiple exposure has been performed; and

processing the developed substrate.

26. The exposure method according to claim 15, wherein the detecting is performed by a detecting system that includes a light-receiving unit, and the light beam has one optical path to the light-receiving unit.

27. An exposure apparatus which exposes a substrate, comprising:

an optical unit which radiates a first exposure light beam from a first area disposed on a first predetermined surface onto a first exposure area and which radiates a second exposure light beam from a second area disposed on a second predetermined surface onto a second exposure area; and

a detecting system having a light-receiving unit which receives a detecting light beam via the first predetermined surface and the second predetermined surface and which obtains information about a positional relationship between a first pattern arranged in the first area and a second pattern arranged in the second area based on a light-receiving result of the light-receiving unit,

wherein the detecting light beam has one optical path, the optical path of the detecting light beam being different from optical paths of the first and second exposure light beams; and

the light-receiving unit receives, as the detecting light beam, at least one of a light beam from a third area which is disposed on the first predetermined surface and which is different from the first area and a light beam from a fourth area which is disposed on the second predetermined surface and which is different from the second area;

the optical unit has a first optical system into which the first exposure light beam from the first area comes and a second optical system which is different from the first optical system and into which the second exposure light beam from the second area comes;

the first optical system is capable of supplying the light beam from the third area to the second optical system;

the second optical system is capable of supplying the light beam from the fourth area to the first optical system; and

the light-receiving unit receives, as the detecting light beam, at least one of the light beam from the third area and the light beam from the fourth area via the first optical system and the second optical system.

28. The exposure apparatus according to claim 27, wherein the optical path of the detecting light beam includes the first predetermined surface, the second predetermined surface and the light-receiving unit in this order.

29. The exposure apparatus according to claim 27, wherein the light-receiving unit receives the detecting light beam via at least a part of the optical unit.

30. The exposure apparatus according to claim 27, wherein the optical unit has an intermediate optical member which is arranged in the vicinity of positions optically conjugate with the first exposure area and the second exposure area, respectively, to which the first exposure light beam from the first area and the second exposure light beam from the second area come, and which guides the first exposure light beam from the first area and the second exposure light beam from the second area to the first exposure area and the second exposure area respectively.

31. The exposure apparatus according to claim 30, wherein the intermediate optical member has a first reflecting surface which reflects the first exposure light beam coming from the first area and a second reflecting surface which reflects the second exposure light beam coming from the second area.

32. The exposure apparatus according to claim 30, wherein:

the optical unit has a single optical element to which the substrate is arranged to be opposite;

the intermediate optical member guides the first exposure light beam from the first area and the second exposure light beam from the second area to the single optical element; and

the first exposure light beam and the second exposure light beam are radiated onto the first exposure area and the second exposure area respectively via the single optical element.

33. The exposure apparatus according to claim 30, wherein the light-receiving unit receives the detecting light beam not via the intermediate optical member.

34. The exposure apparatus according to claim 27, wherein the light-receiving unit receives, as the detecting light beam, a light beam from at least one of a first mark which is arranged in a predetermined positional relationship with respect to the first pattern and a second mark which is arranged in a predetermined positional relationship with respect to the second pattern.

35. The exposure apparatus according to claim 27, wherein the detecting system includes a radiation unit which radiates the detecting light beam onto at least one of the third area and the fourth area.

36. The exposure apparatus according to claim 35, wherein the detecting light beam has a wavelength which is different from that of the first and second exposure light beams.

37. The exposure apparatus according to claim 35, wherein the detecting light beam has a wavelength same as that of the first and second exposure light beams.

38. The exposure apparatus according to claim 27, wherein a part of at least one of the first exposure light beam and the second exposure light beam is radiated, as the detecting light beam, onto at least one of the third area and the fourth area.

39. The exposure apparatus according to claim 27, wherein the first exposure light beam and the second exposure light beam are radiated onto the first exposure area and the second exposure area respectively while adjusting the positional relationship between the first pattern and the second pattern based on the information obtained by the detecting system.

40. The exposure apparatus according to claim 27, wherein:

the optical unit is capable of forming an image of the first pattern in the first exposure area by radiating the first exposure light beam onto the first exposure area, and the optical unit is capable of forming an image of the second pattern in the second exposure area by radiating the second exposure light beam onto the second exposure area; and

a predetermined area on the substrate is subjected to multiple exposure with the image of the first pattern formed in the first exposure area and the image of the second pattern formed in the second exposure area.

41. A method for producing a device, comprising using the exposure apparatus as defined in claim 27.

42. An exposure method for exposing a substrate, the exposure method comprising:

radiating with an optical unit a first exposure light beam from a first area disposed on a first predetermined surface onto a first exposure area and radiating with the optical unit a second exposure light beam from a second area disposed on a second predetermined surface onto a second exposure area;

detecting a light beam via the first predetermined surface and the second predetermined surface, the light beam having one optical path, the optical path of the light beam being different from optical paths of the first and second exposure light beams; and

obtaining information about a positional relationship between a first pattern arranged in the first area and a second pattern arranged in the second area based on a detection result; and

receiving with a light-receiving unit, as the detecting light beam, at least one of a light beam from a third area which is disposed on the first predetermined surface and which is different from the first area and a light beam from a fourth area which is disposed on the second predetermined surface and which is different from the second area,

wherein the optical unit has a first optical system into which the first exposure light beam from the first area comes and a second optical system which is different from the first optical system and into which the second exposure light beam from the second area comes,

the first optical system is capable of supplying the light beam from the third area to the second optical system,

the second optical system is capable of supplying the light beam from the fourth area to the first optical system, and

the light-receiving unit receives, as the detecting light beam, at least one of the light beam from the third area and the light beam from the fourth area via the first optical system and the second optical system.

43. The exposure method according to claim 42, wherein the optical path of the light beam includes the first predetermined surface and the second predetermined surface in this order.

44. The exposure method according to claim 42, further comprising adjusting the positional relationship between the first pattern and the second pattern based on the information about the positional relationship.

45. The exposure method according to claim 44, wherein the positional relationship between the first and second patterns is adjusted at least during the radiation of the first and second exposure light beams.

46. The exposure method according to claim 44, wherein the positional relationship between the first and second patterns is adjusted at least before the substrate is exposed with the first and second exposure light beams.

47. The exposure method according to claim 42, wherein the information about the positional relationship between the first pattern and the second pattern is obtained by detecting marks arranged on the first predetermined surface and the second predetermined surface.

48. The exposure method according to claim 47, wherein the marks are arranged outside the first area and the second area.

49. The exposure method according to claim 42, wherein the light beam via the first predetermined surface and the second predetermined surface has a wavelength which is different from that of the first and second exposure light beams.

50. The exposure method according to claim 42, wherein the light beam via the first predetermined surface and the second predetermined surface has a wavelength same as that of the first and second exposure light beams.

51. The exposure method according to claim 42, wherein the substrate is subjected to multiple exposure with images of the first and second patterns formed in the first and second exposure areas by being irradiated with the first and second exposure light beams.

52. A method for producing a device, comprising:

performing multiple exposure for a substrate by using the exposure method as defined in claim 42;

developing the substrate subjected for which the multiple exposure has been performed; and

processing the developed substrate.