×

System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router

  • US 7,785,485 B2
  • Filed: 09/17/2004
  • Issued: 08/31/2010
  • Est. Priority Date: 09/17/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:

  • machining at least one blade profile in the wafer of crystalline material at least on a first side of the wafer with a router;

    subsequently, isotropically etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile; and

    singulating the etched crystalline material surgical blades.

View all claims
  • 13 Assignments
Timeline View
Assignment View
    ×
    ×