System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router
First Claim
1. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
- machining at least one blade profile in the wafer of crystalline material at least on a first side of the wafer with a router;
subsequently, isotropically etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile; and
singulating the etched crystalline material surgical blades.
13 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing blades for surgical and other uses from either a crystalline or polycrystalline material, preferably in the form of a wafer, comprises preparing the crystalline or polycrystalline wafers by mounting them and machining trenches into the wafers. The methods for machining the trenches, which form the bevel blade surfaces, include a diamond blade saw, laser system, ultrasonic machine, a hot forge press and a router. When a router is used, through-holes are drilled in the wafer to define the starting locations of the trenches. After the trenches are formed, the wafers are placed in an etchant solution which isotropically etches the wafers in a uniform manner, such that layers of crystalline or polycrystalline material are removed uniformly, producing single or double bevel blades, with each bevel having one or more facets. Nearly any bevel angle can be machined into the wafer which remains after etching. The resulting radii of the blade edges is 5-500 nm, which is the same caliber as a diamond edged blade, but manufactured at a fraction of the cost.
-
Citations
47 Claims
-
1. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material at least on a first side of the wafer with a router; subsequently, isotropically etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile; and singulating the etched crystalline material surgical blades. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
-
-
2. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material on its first side with a router; and subsequently, etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile, wherein the machining step comprises; drilling at least one or more though-holes in the wafer of crystalline material; inserting a spinning router into the at least one or more though holes; moving the router to form a profile in the wafer of crystalline material; and retracting the router after the profile in the wafer of crystalline material has been fully formed. - View Dependent Claims (3, 4, 5, 6)
-
-
7. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material on its first side with a router; and subsequently, etching the wafer of crystalline material to form at least one cutting device, wherein the etching step comprises; placing the wafer of crystalline material with at least one blade profile on a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an isotropic acid bath; etching the crystalline material in a uniform manner such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp cutting device edge is etched in the shape of the at least one blade profile. - View Dependent Claims (8, 9)
-
-
10. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material on its first side with a router; and subsequently, etching the wafer of crystalline material to form at least one cutting device, wherein the etching step comprises; placing the wafer of crystalline material with at least one blade profile in a wafer boat; spraying a spray etchant at the wafer boat and wafer of crystalline material with at least one blade profile; etching the crystalline material in a uniform manner with the spray etchant such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp cutting device edge is etched in the shape of the at least one blade profile.
-
-
11. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material on its first side with a router; and subsequently, etching the wafer of crystalline material to form at least one cutting device, wherein the etching step comprises; placing the wafer of crystalline material with at least one blade profile on a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas environment; etching the crystalline material in a uniform manner with the isotropic xenon difluoride, sulfur hexafluoride or similar fluorinated gas such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp cutting device edge is etched in the shape of the at least one blade profile.
-
-
12. A method for manufacturing a cutting device from a wafer of crystalline material, comprising:
-
machining at least one blade profile in the wafer of crystalline material on its first side with a router; and subsequently, etching the wafer of crystalline material to form at least one cutting device, wherein the etching step comprises; placing the wafer of crystalline material with at least one blade profile in a wafer boat; immersing the wafer boat and wafer of crystalline material with at least one blade profile in an electrolytic bath; etching the crystalline material in a uniform manner with the electrolytic bath such that the crystalline material is removed in a uniform manner on any exposed surface, whereby a sharp cutting device edge is etched in the shape of the at least one blade profile.
-
-
32. A method for manufacturing a cutting device from a crystalline material, comprising:
-
mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality of through hole fiducials are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side with a router; subsequently, etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile; singulating the at least one etched crystalline material cutting device; and radiating the at least one singulated etched crystalline material cutting device with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39)
-
-
40. A method for manufacturing a cutting device from a crystalline material, comprising:
-
mounting a wafer of crystalline material on a mounting assembly; pre-cutting the mounted wafer of crystalline material, such that a plurality slots are cut to assist in the machining step; machining at least one blade profile in the wafer of crystalline material on its first side with a router; subsequently, etching the wafer of crystalline material to form at least one cutting device including at least one cutting edge comprising at least a portion of the at least one blade profile; singulating the at least one etched crystalline material cutting device; and radiating the at least one singulated etched crystalline material cutting device with ultra-violet light, to separate them from the mounting assembly, in preparation for packaging for sale. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
-
Specification