Chip-based thermo-stack
First Claim
1. A method comprising:
- forming a trench through at least a portion of a first electronic chip and a portion of a second electronic chip; and
sealing a fluid in the trench to form a tube between the first electronic chip and the second electronic chip, wherein the fluid is configured to transfer heat away from the first electronic chip and the second electronic chip.
1 Assignment
0 Petitions
Accused Products
Abstract
A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through-chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.
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Citations
37 Claims
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1. A method comprising:
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forming a trench through at least a portion of a first electronic chip and a portion of a second electronic chip; and sealing a fluid in the trench to form a tube between the first electronic chip and the second electronic chip, wherein the fluid is configured to transfer heat away from the first electronic chip and the second electronic chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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arranging a first electronic chip adjacent to a second electronic chip to form a stack; forming a through-chip connection between the first electronic chip and the second electronic chip to form a tube; and sealing a fluid within the tube, wherein the fluid is configured to transfer heat away from the first electronic chip and the second electronic chip. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method comprising:
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arranging a first electronic chip adjacent to a second electronic chip to form a stack; coupling the first electronic chip to the second electronic chip using a through-chip connection; and hermetically sealing a fluid within the through-chip connection, wherein the fluid is configured to transfer heat away from the first electronic chip and the second electronic chip, and wherein the through-chip connection is configured to conduct electrical signals between the first electronic chip and the second electronic chip. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37)
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Specification