Camera module with window mechanical attachment

• US 7,786,429 B2
• Filed: 08/08/2008
• Issued: 08/31/2010
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven
• Primary Examiner(s): Epps, Georgia Y
• Assistant Examiner(s): Ko, Tony
• Application Number:
  US12/221,948
• Publication Number:
  US 20080308717A1
• Time in Patent Office: 753 Days
• Field of Search: 250/239, 257/433, 257/434, 257/81, 257/84, 438/64, 438/48, 438/69, 438/54
• US Class Current: 250/239
• CPC Class Codes: B29C 2043/023 having a plurality of grooves
• CPC Class Codes: B29C 33/0022 Multi-cavity moulds B29C33/301 takes precedence
• CPC Class Codes: B29C 43/36 Moulds for making articles of definite length, i.e. discrete articles
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Claims

1. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, the image sensor being coupled to a first surface of the substrate;

a molding coupled to the first surface of the substrate, the molding comprising a locking feature, the locking feature consisting of a rectangular bar extending from the molding; and

a hook-like feature attached to the locking feature.

2. The camera module of claim 1 wherein the camera module is mounted on a larger substrate.

3. The camera module of claim 1 wherein the camera module is electrically connected to a larger substrate.

4. The camera module of claim 1 further comprising a means for electrically connecting the camera module to a larger substrate.

5. The camera module of claim 4 wherein the means for electrically connecting is coupled to a second surface of the substrate.

6. The camera module of claim 1 further comprising an adhesive layer coupling the molding to the substrate.

7. The camera module of claim 6 wherein the molding is attached to a periphery of the first surface of the substrate by the adhesive layer.

8. The camera module of claim 1 wherein bond pads of the image sensor are coupled to traces of the substrate.

9. The cameral module of claim 1 further comprising bond wires coupling bond pads of the image sensor to traces of the substrate.

10. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, the image sensor being coupled to a first surface of the substrate;

a molding comprising a means for locking, the means for locking consisting of a rectangular bar extending from the molding;

a mechanical attachment means attached to the means for locking; and

a window between the mechanical attachment means and the molding.

11. The camera module of claim 10 further comprising an adhesive layer attaching the molding to the substrate, wherein the window, the molding, the adhesive layer, and the substrate form an enclosure around the image sensor.

12. The camera module of claim 10 wherein the mechanical attachment means comprises a plurality of alignment notches.

13. The camera module of claim 10 wherein the mechanical attachment means comprises:

a compression ring section comprising a central aperture.

14. The camera module of claim 13 wherein a central region of the window is exposed through the central aperture.

15. The camera module of claim 10 wherein the molding comprises a first pocket comprising a shelf, the shelf supporting a peripheral region of an interior surface of the window.

16. The camera module of claim 15 wherein the first pocket further comprises sides having a width substantially the same as a width of sides of the window.

17. The camera module of claim 10 wherein the means for locking comprises a lip, the mechanical attachment means comprising an inwardly extending tab in abutting contact with the lip.

18. The camera module of claim 17 wherein the mechanical attachment means further comprises a taper.

19. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, the image sensor being coupled to a first surface of the substrate;

a molding coupled to the substrate, the molding comprising a first pocket and a locking feature, the locking feature consisting of a rectangular bar extending from the molding;

a window in the first pocket; and

a means for securing the window in the first pocket, the means for securing being coupled to the rectangular bar of the molding.

20. The camera module of claim 19 further comprising a means for electrically connecting the camera module to a larger substrate.