Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire
First Claim
Patent Images
1. A circuit substrate, comprising:
- a substrate body;
a first terminal disposed over the substrate body;
a second terminal disposed over the substrate body and separated from the first terminal; and
a circuit wire comprising;
a wiring unit for electrically connecting the first and second terminals by electrically connecting a plurality of conductive polarization particles, wherein each conductive polarization particle of the plurality of conductive polarization particles has a first polarity and a second polarity that is opposite to the first polarity; and
an insulation unit for insulating the wiring unit.
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Abstract
A circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit.
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Citations
43 Claims
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1. A circuit substrate, comprising:
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a substrate body; a first terminal disposed over the substrate body; a second terminal disposed over the substrate body and separated from the first terminal; and a circuit wire comprising; a wiring unit for electrically connecting the first and second terminals by electrically connecting a plurality of conductive polarization particles, wherein each conductive polarization particle of the plurality of conductive polarization particles has a first polarity and a second polarity that is opposite to the first polarity; and an insulation unit for insulating the wiring unit. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacturing a circuit substrate, comprising the steps of:
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forming a first terminal on a surface of a substrate body; forming a second terminal on the surface of the substrate body; forming a preliminary circuit wire by connecting the first and second terminals with a wiring material, the wiring material comprising; a plurality of conductive polarization particles having a first polarity and a second polarity that is opposite the first polarity; and a flowable insulator; forming a wiring unit electrically connected to the first and second terminals by applying a first power having the first polarity to the first terminal and a second power having the second polarity to the second terminal and thus electrically connecting the conductive polarization particles within the flowable insulator; and forming an insulation unit for securing and insulating the wiring unit by curing the flowable insulator. - View Dependent Claims (7, 8, 9)
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10. A semiconductor package, comprising:
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a semiconductor chip; a plurality of bonding pads formed over an upper surface of the semiconductor chip; a plurality of conductive land patterns separated from the plurality of bonding pads; and a plurality of circuit wires, each circuit wire comprising; a wiring unit for electrically connecting a bonding pad of the plurality of bonding pads and a conductive land pattern of the plurality of land patterns corresponding to the bonding pad by electrically connecting a plurality of conductive polarization particles respectively having a first polarity and a second polarity that is opposite to the first polarity; and an insulation unit for insulating the wiring unit. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A semiconductor package, comprising:
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a substrate having connection pads formed thereon; a semiconductor chip module comprising a plurality of semiconductor chips having pads formed thereon; and a plurality of circuit wires, each circuit wire comprising; a wiring unit for electrically connecting a pad of respective semiconductor chips and a connection pad corresponding to the pad by electrically connecting a plurality of conductive polarization particles having a first polarity and a second polarity opposite to the first polarity; and an insulation unit for covering the wiring unit. - View Dependent Claims (24, 25, 26)
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27. A semiconductor package, comprising:
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a substrate having connection pads formed thereon; a semiconductor chip module comprising a plurality of semiconductor chips respectively having exposed chip selection pads; and a plurality of circuit wires, each circuit wire comprising; a wiring unit for electrically connecting a chip selection pad of respective semiconductor chips and a connection pad corresponding to the chip selection pad by electrically connecting a plurality of conductive polarization particles having a first polarity and a second polarity opposite the first polarity; and an insulation unit for covering the wiring unit. - View Dependent Claims (28, 29, 30, 31, 32)
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33. A semiconductor package, comprising:
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a semiconductor chip comprising; a circuit unit; a bonding pad electrically connected to the circuit unit; and a through hole electrically connected to the circuit unit; a through electrode unit disposed within the through hole and electrically connected to the bonding pad, the through unit comprising a plurality of conductive polarization particles having a first polarity and a second polarity opposite the first polarity and electrically connected to each other; and insulation units for insulating the through electrodes. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification